Investigation of Surface Treatment Methods for 3D Printed Optical Components

Joshua C. Davidson, Jianan Zhang, Timothy Joseph Kane, Ram Mohan Narayanan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The following proposes a method for preparing 3D printed surfaces as commercial quality optical components. Utilizing Formlabs' dipping method and pulse-reverse electroplating, a surface finish of lambda/10 can be achieved. Optical profilometry (OP) and scanning electron microscopy (SEM) suggest a surface quality that is comparable to the industry standard of 80 / 50. Optimization and integration of this surface treatment process as a post-printing step would enable additive manufacturing to be a feasible approach for developing optical components.

Original languageEnglish (US)
Title of host publication2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781943580576
DOIs
StatePublished - May 1 2019
Event2019 Conference on Lasers and Electro-Optics, CLEO 2019 - San Jose, United States
Duration: May 5 2019May 10 2019

Publication series

Name2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings

Conference

Conference2019 Conference on Lasers and Electro-Optics, CLEO 2019
CountryUnited States
CitySan Jose
Period5/5/195/10/19

All Science Journal Classification (ASJC) codes

  • Spectroscopy
  • Industrial and Manufacturing Engineering
  • Safety, Risk, Reliability and Quality
  • Management, Monitoring, Policy and Law
  • Electronic, Optical and Magnetic Materials
  • Radiology Nuclear Medicine and imaging
  • Instrumentation
  • Atomic and Molecular Physics, and Optics

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  • Cite this

    Davidson, J. C., Zhang, J., Kane, T. J., & Narayanan, R. M. (2019). Investigation of Surface Treatment Methods for 3D Printed Optical Components. In 2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings [8749754] (2019 Conference on Lasers and Electro-Optics, CLEO 2019 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/CLEO.2019.8749754