Large scale statistics for computational verification of grain growth simulations with experiments

Melik C. Demirel, Andrew P. Kuprat, Denise C. George, Galen K. Straub, Amit Misra, Kathleen Alexander, Anthony D. Rollett

Research output: Contribution to journalConference article

Abstract

It is known that by controlling microstructural development, desirable properties of materials can be achieved. The main objective of our research is to understand and control interface dominated material properties, and finally, to verify experimental results with computer simulations. We have previously showed a strong similarity between small-scale grain growth experiments and anisotropic three-dimensional simulations obtained from the Electron Backscattered Diffraction (EBSD) measurements. Using the same technique, we obtained 5170-grain data from an Aluminum-film (120 μm thick) with a columnar grain structure. Experimentally obtained starting microstructure and grain boundary properties are input for the three-dimensional grain growth simulation. In the computational model, minimization of the interface energy is the driving force for the grain boundary motion. The computed evolved microstructure is compared with the final experimental microstructure, after annealing at 550 °C.

Original languageEnglish (US)
Pages (from-to)195-202
Number of pages8
JournalMaterials Research Society Symposium - Proceedings
Volume731
Publication statusPublished - Jan 1 2002
EventModeling and Numerical Simulation of Materials Behavior and Evolution - San Francisco, CA, United States
Duration: Apr 2 2002Apr 5 2002

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All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Demirel, M. C., Kuprat, A. P., George, D. C., Straub, G. K., Misra, A., Alexander, K., & Rollett, A. D. (2002). Large scale statistics for computational verification of grain growth simulations with experiments. Materials Research Society Symposium - Proceedings, 731, 195-202.