Laser-enhanced electroless plating of silver seed layers for selective electroless copper deposition

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6 Scopus citations

Abstract

Copper (Cu) has been patterned using a laser direct-write metallization technique for fabrication of printed wiring boards. The approach consists of writing a silver (Ag) seed layer with a subsequent step of electroless Cu plating to increase thickness and electrical conductivity. Ag seed layers were patterned with a frequency tripled Nd:YVO4 (λ = 355nm) laser with a spot size of approximately 50μm. Final Cu linewidths after electroless plating were found to be 150 μm with a thickness of 2 μm and electrical resistivity of 5 μΩ cm. An optimal laser power of 0.81W was found by a factorial-type design experiment. A modern prototype circuit was also patterned with this technique, demonstrating its compatibility with current resolution requirements.

Original languageEnglish (US)
Pages (from-to)218-223
Number of pages6
JournalJournal of Laser Applications
Volume20
Issue number4
DOIs
StatePublished - Dec 1 2008

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Biomedical Engineering
  • Instrumentation

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