In this study, we report results on a piezoelectric-material-based mechanical energy-harvesting device that was fabricated by combining laser machining with microelectronics packaging technology. It was found that the laser-machining process did not have significant effect on the electrical properties of piezoelectric material. The fabricated device was tested in the low-frequency regime of 50 to 1000 Hz at constant force of 8 g (where g = 9.8m/s2). The device was found to generate continuous power of 1.13 μW at 870 Hz across a 288.5 kΩ load with a power density of 301.3 μW/cm3.
|Original language||English (US)|
|Number of pages||6|
|Journal||IEEE transactions on ultrasonics, ferroelectrics, and frequency control|
|State||Published - Sep 1 2008|
All Science Journal Classification (ASJC) codes
- Acoustics and Ultrasonics
- Electrical and Electronic Engineering