Laser surface processing for stress and damage mitigation in SIC

Ronald L. Jacobsen, Joseph A. Randi, III, Sarah Payne

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper provides an update on experiments in the use of pulsed laser ablation (10 ps to 120 ns) as a technique for mitigation of surface stress and damage in silicon carbide is provided. SiC is of interest for a wide range of applications due to its thermal, optical, and electrical properties as well as its dimensional stability. However, concerns about handling damage and unpredictable breakage may limit its use. Machining, grinding and even polishing of this brittle material leaves a damaged surface layer of depth approximately proportional to the size of the abrasive used to finish it. This damage layer is a potential source of crack initiation, and its mitigation is desirable. The damage layer is accompanied by compressive stress. Measurements of the changes in this stress can be used to track improvements in the surface. The Twyman method is used to demonstrate and quantify the degree to which laser ablation can be used to remove the damage layer in variously prepared samples of SiC, and potentially lead to improved reliability of this material and other brittle materials.

Original languageEnglish (US)
Title of host publication29th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2010 - Congress Proceedings
Pages806-810
Number of pages5
Volume103
StatePublished - Dec 27 2010
Event29th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2010 - Anaheim, CA, United States
Duration: Sep 26 2010Sep 30 2010

Other

Other29th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2010
CountryUnited States
CityAnaheim, CA
Period9/26/109/30/10

Fingerprint

structural influence coefficients
Laser ablation
Brittleness
damage
Lasers
Processing
brittle materials
lasers
Dimensional stability
laser ablation
Polishing
Pulsed lasers
Compressive stress
Abrasives
Crack initiation
Silicon carbide
Machining
Electric properties
Thermodynamic properties
Optical properties

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Radiation

Cite this

Jacobsen, R. L., Randi, III, J. A., & Payne, S. (2010). Laser surface processing for stress and damage mitigation in SIC. In 29th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2010 - Congress Proceedings (Vol. 103, pp. 806-810)
Jacobsen, Ronald L. ; Randi, III, Joseph A. ; Payne, Sarah. / Laser surface processing for stress and damage mitigation in SIC. 29th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2010 - Congress Proceedings. Vol. 103 2010. pp. 806-810
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Jacobsen, RL, Randi, III, JA & Payne, S 2010, Laser surface processing for stress and damage mitigation in SIC. in 29th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2010 - Congress Proceedings. vol. 103, pp. 806-810, 29th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2010, Anaheim, CA, United States, 9/26/10.

Laser surface processing for stress and damage mitigation in SIC. / Jacobsen, Ronald L.; Randi, III, Joseph A.; Payne, Sarah.

29th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2010 - Congress Proceedings. Vol. 103 2010. p. 806-810.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Jacobsen RL, Randi, III JA, Payne S. Laser surface processing for stress and damage mitigation in SIC. In 29th International Congress on Applications of Lasers and Electro-Optics, ICALEO 2010 - Congress Proceedings. Vol. 103. 2010. p. 806-810