Abstract
Conducting polymers are prevalently used in organic and flexible electronics and energy conversion devices. While their thermo-physical properties are well characterized for different processing and doping conditions, very little is known about the effect of length-scale, especially their thermal conductivity and thermal contact resistance of their interfaces with substrates. In this paper we develop an analytical model to capture the heat transfer in ultra-thin polyaniline thin films and their interfaces with other substrate materials. The model is demonstrated on 20-1000 nm thick 50% camphor-sulphonic acid doped polyaniline films patterned on silicon substrate using photolithography and reactive ion etching. The four-probe based technique allows simultaneous electrical and thermal characterization. Experimental results show a 500% and 200% increase in the in-plane thermal conductivity and electrical conductivity, respectively as the film thickness is increased from 20 nm to 1000 nm. These findings suggest up to 300% improvement in thermoelectric performance for 20 nm thick films when compared to the bulk. Such strong length-scale effects are observed to decay rapidly after 100 nm film thickness and can be attributed to the enhanced phonon scattering at the surface and interface boundaries at length-scales comparable to phonon mean free paths.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 29-35 |
| Number of pages | 7 |
| Journal | Organic Electronics |
| Volume | 11 |
| Issue number | 1 |
| DOIs | |
| State | Published - Jan 1 2010 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Biomaterials
- Chemistry(all)
- Condensed Matter Physics
- Materials Chemistry
- Electrical and Electronic Engineering
Cite this
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Length-scale effects on electrical and thermal transport in polyaniline thin films. / Jin, Jiezhu; Wang, Qing; Haque, Md Amanul.
In: Organic Electronics, Vol. 11, No. 1, 01.01.2010, p. 29-35.Research output: Contribution to journal › Article
TY - JOUR
T1 - Length-scale effects on electrical and thermal transport in polyaniline thin films
AU - Jin, Jiezhu
AU - Wang, Qing
AU - Haque, Md Amanul
PY - 2010/1/1
Y1 - 2010/1/1
N2 - Conducting polymers are prevalently used in organic and flexible electronics and energy conversion devices. While their thermo-physical properties are well characterized for different processing and doping conditions, very little is known about the effect of length-scale, especially their thermal conductivity and thermal contact resistance of their interfaces with substrates. In this paper we develop an analytical model to capture the heat transfer in ultra-thin polyaniline thin films and their interfaces with other substrate materials. The model is demonstrated on 20-1000 nm thick 50% camphor-sulphonic acid doped polyaniline films patterned on silicon substrate using photolithography and reactive ion etching. The four-probe based technique allows simultaneous electrical and thermal characterization. Experimental results show a 500% and 200% increase in the in-plane thermal conductivity and electrical conductivity, respectively as the film thickness is increased from 20 nm to 1000 nm. These findings suggest up to 300% improvement in thermoelectric performance for 20 nm thick films when compared to the bulk. Such strong length-scale effects are observed to decay rapidly after 100 nm film thickness and can be attributed to the enhanced phonon scattering at the surface and interface boundaries at length-scales comparable to phonon mean free paths.
AB - Conducting polymers are prevalently used in organic and flexible electronics and energy conversion devices. While their thermo-physical properties are well characterized for different processing and doping conditions, very little is known about the effect of length-scale, especially their thermal conductivity and thermal contact resistance of their interfaces with substrates. In this paper we develop an analytical model to capture the heat transfer in ultra-thin polyaniline thin films and their interfaces with other substrate materials. The model is demonstrated on 20-1000 nm thick 50% camphor-sulphonic acid doped polyaniline films patterned on silicon substrate using photolithography and reactive ion etching. The four-probe based technique allows simultaneous electrical and thermal characterization. Experimental results show a 500% and 200% increase in the in-plane thermal conductivity and electrical conductivity, respectively as the film thickness is increased from 20 nm to 1000 nm. These findings suggest up to 300% improvement in thermoelectric performance for 20 nm thick films when compared to the bulk. Such strong length-scale effects are observed to decay rapidly after 100 nm film thickness and can be attributed to the enhanced phonon scattering at the surface and interface boundaries at length-scales comparable to phonon mean free paths.
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U2 - 10.1016/j.orgel.2009.09.018
DO - 10.1016/j.orgel.2009.09.018
M3 - Article
AN - SCOPUS:72649094471
VL - 11
SP - 29
EP - 35
JO - Organic Electronics: physics, materials, applications
JF - Organic Electronics: physics, materials, applications
SN - 1566-1199
IS - 1
ER -