Lightweight diamond based composites with advanced thermal properties

E. Neubauer, I. Smid, K. Cowan, H. Yu, P. Angerer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

The continuous increase of power density in electronic devices requires advanced materials with high thermal conductivity combined with a reduced coefficient of thermal expansion (CTE). For application of diamond based composites as heat sink or electronic housings in mobile applications an additional requirement is low weight. The combination of a light weight matrix material, e.g. aluminum with diamond as a filler having a high thermal conductivity but low CTE results in a material with thermal conductivities in the range of 300 to 600 W/mK combined with reduced coefficient of thermal expansion. Usually aluminum-diamond composites are reported to be prepared in literature by infiltration processes (squeeze casting or gas pressure infiltration). A PM approach was used to prepare aluminium-diamond composites. Large plates with size of 150mm×150mm were prepared and characterised with respect to the thermal diffusivity/conductivity by using a local thermal mapping technique. In addition first results of thermal analysis from PM prepared Mg-diamond composites are reported.

Original languageEnglish (US)
Title of host publicationProceedings of the Euro International Powder Metallurgy Congress and Exhibition, Euro PM 2008
PublisherEuropean Powder Metallurgy Association (EPMA)
Pages93-98
Number of pages6
ISBN (Print)9781899072033
StatePublished - 2008
EventEuropean International Powder Metallurgy Congress and Exhibition, Euro PM 2008 - Mannheim, Germany
Duration: Sep 29 2008Oct 1 2008

Publication series

NameProceedings of the Euro International Powder Metallurgy Congress and Exhibition, Euro PM 2008
Volume2

Other

OtherEuropean International Powder Metallurgy Congress and Exhibition, Euro PM 2008
Country/TerritoryGermany
CityMannheim
Period9/29/0810/1/08

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Ceramics and Composites
  • Materials Chemistry
  • Metals and Alloys
  • Condensed Matter Physics

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