Lightweight diamond based composites with advanced thermal properties

E. Neubauer, Ivica Smid, K. Cowan, H. Yu, P. Angerer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

The continuous increase of power density in electronic devices requires advanced materials with high thermal conductivity combined with a reduced coefficient of thermal expansion (CTE). For application of diamond based composites as heat sink or electronic housings in mobile applications an additional requirement is low weight. The combination of a light weight matrix material, e.g. aluminum with diamond as a filler having a high thermal conductivity but low CTE results in a material with thermal conductivities in the range of 300 to 600 W/mK combined with reduced coefficient of thermal expansion. Usually aluminum-diamond composites are reported to be prepared in literature by infiltration processes (squeeze casting or gas pressure infiltration). A PM approach was used to prepare aluminium-diamond composites. Large plates with size of 150mm×150mm were prepared and characterised with respect to the thermal diffusivity/conductivity by using a local thermal mapping technique. In addition first results of thermal analysis from PM prepared Mg-diamond composites are reported.

Original languageEnglish (US)
Title of host publicationProceedings of the Euro International Powder Metallurgy Congress and Exhibition, Euro PM 2008
PublisherEuropean Powder Metallurgy Association (EPMA)
Pages93-98
Number of pages6
ISBN (Print)9781899072033
StatePublished - Jan 1 2008
EventEuropean International Powder Metallurgy Congress and Exhibition, Euro PM 2008 - Mannheim, Germany
Duration: Sep 29 2008Oct 1 2008

Publication series

NameProceedings of the Euro International Powder Metallurgy Congress and Exhibition, Euro PM 2008
Volume2

Other

OtherEuropean International Powder Metallurgy Congress and Exhibition, Euro PM 2008
CountryGermany
CityMannheim
Period9/29/0810/1/08

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Ceramics and Composites
  • Materials Chemistry
  • Metals and Alloys
  • Condensed Matter Physics

Fingerprint Dive into the research topics of 'Lightweight diamond based composites with advanced thermal properties'. Together they form a unique fingerprint.

  • Cite this

    Neubauer, E., Smid, I., Cowan, K., Yu, H., & Angerer, P. (2008). Lightweight diamond based composites with advanced thermal properties. In Proceedings of the Euro International Powder Metallurgy Congress and Exhibition, Euro PM 2008 (pp. 93-98). (Proceedings of the Euro International Powder Metallurgy Congress and Exhibition, Euro PM 2008; Vol. 2). European Powder Metallurgy Association (EPMA).