Lightweight diamond based composites with advanced thermal properties

E. Neubauer, M. Kitzmantel, I. Smid, K. Cowan, H. Yu, P. Angerer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The continuous increase of power density in electronic devices requires advanced materials with high thermal conductivity combined with a reduced coefficient of thermal expansion (CTE). For application of diamond based composites as heat sink or heat spreader in mobile applications an additional requirement is low weight. The combination of a light weight matrix material, e.g. aluminium with diamond as a filler having a high thermal conductivity but low CTE results in a material with thermal conductivities in the range of 300 to 600 W/mK combined with a CTE of around 9-12 ppm/K. For the preparation of this composite a PM approach is used. In addition it will be shown that this method allows the preparation of certain shapes. Problems such as machining of these composites are discussed and possible solutions will be presented.

Original languageEnglish (US)
Title of host publicationAdvances in Powder Metallurgy and Particulate Materials - 2008, Proceedings of the 2008 World Congress on Powder Metallurgy and Particulate Materials, PowderMet 2008
Pages981-989
Number of pages9
StatePublished - Dec 1 2008
Event2008 World Congress on Powder Metallurgy and Particulate Materials, PowderMet 2008 - Washington, DC, United States
Duration: Jun 8 2008Jun 12 2008

Publication series

NameAdvances in Powder Metallurgy and Particulate Materials - 2008, Proceedings of the 2008 World Congress on Powder Metallurgy and Particulate Materials, PowderMet 2008

Other

Other2008 World Congress on Powder Metallurgy and Particulate Materials, PowderMet 2008
CountryUnited States
CityWashington, DC
Period6/8/086/12/08

All Science Journal Classification (ASJC) codes

  • Metals and Alloys
  • Surfaces and Interfaces

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