Load transfer and bond fatigue in an embedded induced strain actuator

Moreshwar L. Deshpande, Suresh P. Pai, George A. Lesieutre, Gary H. Koopmann

Research output: Contribution to journalConference article

Abstract

An embedded piezoceramic induced strain actuator transfer actuation to the host composite mainly through shear action over the faces of the actuator. The Synthesis and Processing of Intelligent Cost Effective Structures (SPICES) actuator, analyzed in this paper, is an induced strain actuator, comprising of a co-fired piezoelectric stack, encased within a titanium frame, and excited in the 3-3 mode. The shear stresses are maximum at the edge of the piezoelectric stack, while the normal stresses are uniform over the piezoelectric stack. Both decrease exponentially towards the edge of the frame. The shear stresses though much smaller than the normal stresses are responsible for the load transfer to the composite. The actuator-composite interface is subjected to fatigue. Any failure or deterioration in this bond will significantly reduce the efficiency of the actuator. Debonding starts near the interface of the PZT and the frame and reduces the load transfer to the composite. This reduction is found to be quite low for small amounts of debonding. Experiments show that, specimens fatigued to a million cycles showed an average decrease of 6 percent from the non-fatigued specimen.

Original languageEnglish (US)
JournalAmerican Society of Mechanical Engineers (Paper)
StatePublished - Dec 1 1995
EventProceedings of the 1995 ASME International Mechanical Engineering Congress & Exposition - San Francisco, CA, USA
Duration: Nov 12 1995Nov 17 1995

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Load transfer and bond fatigue in an embedded induced strain actuator'. Together they form a unique fingerprint.

  • Cite this