Low temperature cure adhesive for honeycomb repair applications

P. A. Mehrkam, M. F. DiBerardino, Thomas M. Donnellan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

An epoxy adhesive suitable for field repair applications was developed at the Naval Air Development Center (NADC). This material is a two part adhesive which consists of diglycidyl ether of bisphenol-A epoxy, carboxy terminated butadiene nitrile rubber, and diamino-dicyclohexyl methane. Previous work has shown that the adhesive is ambient temperature storable, that has viscosity and cure characteristics which prevent moisture induced voiding in bonding monolithic laminates, and that it is processable with field repair equipment. Currently adhesive properties have been demonstrated with a 149°C (300°F) 1 hour cure. An adhesive with similar characteristics has been commercialized as Dexter Hysol EA 9391. The upper use temperature of the adhesive under wet conditions is greater than 104°C (220°F). A number of current and emerging applications use honeycomb sandwich structures. The repair of these structures requires lengthy drying cycles to remove entrapped moisture in the core. A program to investigate the effect of alternate (low temperature) processing cycles on the mechanical properties of currently qualified adhesive (Dexter Hysol EA 9391) was performed. Low temperature cure cycles were identified which produced adhesive material properties comparable to those found with the standard cure cycle. It was found that a cure temperature of 93°C (200°F) provided acceptable mechanical strength at 82°C (180°F)/wet and may eliminate the long repair processing times associated with honeycomb structures.

Original languageEnglish (US)
Title of host publicationInternational SAMPE Technical Conference
Editors Anon
PublisherPubl by SAMPE
Pages1072-1082
Number of pages11
ISBN (Print)093899462X
StatePublished - Dec 1 1991
Event23rd International SAMPE Conference - Kiamesha Lake, NY, USA
Duration: Oct 21 1991Oct 24 1991

Publication series

NameInternational SAMPE Technical Conference
Volume23

Other

Other23rd International SAMPE Conference
CityKiamesha Lake, NY, USA
Period10/21/9110/24/91

Fingerprint

Adhesives
Repair
Temperature
Moisture
Honeycomb structures
Nitriles
Sandwich structures
Rubber
Methane
Processing
Butadiene
Laminates
Strength of materials
Ethers
Materials properties
Drying
Viscosity
Mechanical properties
Air

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Mehrkam, P. A., DiBerardino, M. F., & Donnellan, T. M. (1991). Low temperature cure adhesive for honeycomb repair applications. In Anon (Ed.), International SAMPE Technical Conference (pp. 1072-1082). (International SAMPE Technical Conference; Vol. 23). Publ by SAMPE.
Mehrkam, P. A. ; DiBerardino, M. F. ; Donnellan, Thomas M. / Low temperature cure adhesive for honeycomb repair applications. International SAMPE Technical Conference. editor / Anon. Publ by SAMPE, 1991. pp. 1072-1082 (International SAMPE Technical Conference).
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Mehrkam, PA, DiBerardino, MF & Donnellan, TM 1991, Low temperature cure adhesive for honeycomb repair applications. in Anon (ed.), International SAMPE Technical Conference. International SAMPE Technical Conference, vol. 23, Publ by SAMPE, pp. 1072-1082, 23rd International SAMPE Conference, Kiamesha Lake, NY, USA, 10/21/91.

Low temperature cure adhesive for honeycomb repair applications. / Mehrkam, P. A.; DiBerardino, M. F.; Donnellan, Thomas M.

International SAMPE Technical Conference. ed. / Anon. Publ by SAMPE, 1991. p. 1072-1082 (International SAMPE Technical Conference; Vol. 23).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Mehrkam PA, DiBerardino MF, Donnellan TM. Low temperature cure adhesive for honeycomb repair applications. In Anon, editor, International SAMPE Technical Conference. Publ by SAMPE. 1991. p. 1072-1082. (International SAMPE Technical Conference).