Machine vision inspection of component footprints in PCB artwork

Radha Krishnan, H. J. Sommer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new printed circuit board (PCB) inspection scheme designed to perform automated inspection of component sites is presented. A digitized image of the artwork for a board is stored after digitization via a scanner (300 dots per inch) in a tag image file format (TIFF) file. At inspection time, after reading in the compressed format TIFF file and decoding the compressed image, the PCB is graphically displayed on a PC screen together with a command menu. The user is then taken through a series of menu-driven commands to ultimately check the dimensions of center-to-center distance between holes and pads for electronic components on the PCB. The significance of this research is in the adaptation of the UNION-FIND procedure to develop a robust algorithm to segment an image into component objects and background to facilitate dimensional analysis and inspection of the artwork.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsKevin W. Bowyer
PublisherPubl by Int Soc for Optical Engineering
Pages819-829
Number of pages11
ISBN (Print)0819408735
Publication statusPublished - Jan 1 1992
EventApplications of Artificial Intelligence X: Machine Vision and Robotics - Orlando, FL, USA
Duration: Apr 22 1992Apr 24 1992

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume1708
ISSN (Print)0277-786X

Other

OtherApplications of Artificial Intelligence X: Machine Vision and Robotics
CityOrlando, FL, USA
Period4/22/924/24/92

    Fingerprint

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Krishnan, R., & Sommer, H. J. (1992). Machine vision inspection of component footprints in PCB artwork. In K. W. Bowyer (Ed.), Proceedings of SPIE - The International Society for Optical Engineering (pp. 819-829). (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 1708). Publ by Int Soc for Optical Engineering.