Master decomposition curve for binders in PIM processing

Gaurav Aggarwal, Seong Jin Park, Ivi Smid, Randall M. German

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Thermal debinding is one of the crucial steps in powder injection processing. To systematically analyze and design the thermal debinding step, a master decomposition curve (MDC) has been formulated and constructed based on the intrinsic kinetics of polymer pyrolysis. The Kissinger method is used to estimate the activation energy from thermogravimetric analysis (TGA) experiments. Overall thermal decomposition has been synthesized from the MDC's of individual components of the binder system with good experimental agreement. This can help process designers to change the composition without additional experiments and can help in predicting the remaining amount of each binder component during debinding. The input data are obtained from the industrial debinding practice. In addition, the catalytic or high conduction heat transfer effect of metal powders has been investigated in terms of different powders, shapes, and sizes.

Original languageEnglish (US)
Title of host publicationMPMD 7th Global Innov. Proc.
Subtitle of host publicationTrends in Materials R and D for Sensor Manufacturing Technologies - Proceedings of Symposium sponsored by the Global Innovations Committee of the Materials Proces
Pages29-38
Number of pages10
StatePublished - Dec 1 2006
Event135th TMS Annual Meeting, 2006 - San Antonio, TX, United States
Duration: Mar 12 2006Mar 16 2006

Publication series

NameTMS Annual Meeting
Volume2006

Other

Other135th TMS Annual Meeting, 2006
CountryUnited States
CitySan Antonio, TX
Period3/12/063/16/06

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys

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    Aggarwal, G., Park, S. J., Smid, I., & German, R. M. (2006). Master decomposition curve for binders in PIM processing. In MPMD 7th Global Innov. Proc.: Trends in Materials R and D for Sensor Manufacturing Technologies - Proceedings of Symposium sponsored by the Global Innovations Committee of the Materials Proces (pp. 29-38). (TMS Annual Meeting; Vol. 2006).