Materials Research Society Symposium Proceedings: Preface

Yong S. Cho, Don Shiffler, Clive A. Randall, Harrie A.C. Tilmans, Takaaki Tsurumi

Research output: Contribution to journalConference article

Original languageEnglish (US)
JournalMaterials Research Society Symposium Proceedings
Volume833
StatePublished - Jun 20 2005
EventMaterials, Intergration and Packaging Issues for High-Frequency Devices II - Boston, MA, United States
Duration: Nov 29 2004Dec 1 2004

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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