Measuring SWNT depth in electroactive polymer nanocomposite films using electric force microscopy

Aaron T. Sellinger, Sujay Deshmukh, Zoubeida Ounaies, Sang Nyon Kim, Richard A. Vaia

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Although a number of hypotheses have been presented to explain the enhanced electromechanical performance observed in electroactive polymer nanocomposite materials, many of the underlying mechanisms responsible for this behavior remain unclear. In this report, electric force microscopy (EFM) is used to investigate the near surface morphology of an electroactive polyimide-based nanocomposite film containing SWNTs in an effort to gain insight into the electrical interactions occurring at the polymer-electrode interface. As a means of measuring the proximity of SWNTs to this interface, the depths of SWNTs buried beneath a processing-induced polymer skin layer are determined using EFM measurements derived from a sample standard. In this way, evaluation of the ability for embedded SWNT structures to behave as extensions of surface electrodes is possible, a scenario that could potentially reduce the applied field required to elicit electromechanical actuation.

Original languageEnglish (US)
Title of host publicationBehavior and Mechanics of Multifunctional Materials and Composites 2010
DOIs
StatePublished - Jun 18 2010
EventBehavior and Mechanics of Multifunctional Materials and Composites 2010 - San Diego, CA, United States
Duration: Mar 8 2010Mar 11 2010

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume7644
ISSN (Print)0277-786X

Other

OtherBehavior and Mechanics of Multifunctional Materials and Composites 2010
CountryUnited States
CitySan Diego, CA
Period3/8/103/11/10

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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