Mechanics of finger-tip electronics

Yewang Su, Rui Li, Huanyu Cheng, Ming Ying, Andrew P. Bonifas, Keh Chih Hwang, John A. Rogers, Yonggang Huang

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

Tactile sensors and electrotactile stimulators can provide important links between humans and virtual environments, through the sensation of touch. Soft materials, such as low modulus silicones, are attractive as platforms and support matrices for arrays sensors and actuators that laminate directly onto the fingertips. Analytic models for the mechanics of three dimensional, form-fitting finger cuffs based on such designs are presented here, along with quantitative validation using the finite element method. The results indicate that the maximum strains in the silicone and the embedded devices are inversely proportional to the square root of radius of curvature of the cuff. These and other findings can be useful in formulating designs for these and related classes of body-worn, three dimensional devices.

Original languageEnglish (US)
Article number164511
JournalJournal of Applied Physics
Volume114
Issue number16
DOIs
StatePublished - Oct 28 2013

Fingerprint

cuffs
silicones
three dimensional bodies
touch
electronics
laminates
finite element method
platforms
actuators
curvature
radii
sensors
matrices

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

Cite this

Su, Y., Li, R., Cheng, H., Ying, M., Bonifas, A. P., Hwang, K. C., ... Huang, Y. (2013). Mechanics of finger-tip electronics. Journal of Applied Physics, 114(16), [164511]. https://doi.org/10.1063/1.4828476
Su, Yewang ; Li, Rui ; Cheng, Huanyu ; Ying, Ming ; Bonifas, Andrew P. ; Hwang, Keh Chih ; Rogers, John A. ; Huang, Yonggang. / Mechanics of finger-tip electronics. In: Journal of Applied Physics. 2013 ; Vol. 114, No. 16.
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Su, Y, Li, R, Cheng, H, Ying, M, Bonifas, AP, Hwang, KC, Rogers, JA & Huang, Y 2013, 'Mechanics of finger-tip electronics', Journal of Applied Physics, vol. 114, no. 16, 164511. https://doi.org/10.1063/1.4828476

Mechanics of finger-tip electronics. / Su, Yewang; Li, Rui; Cheng, Huanyu; Ying, Ming; Bonifas, Andrew P.; Hwang, Keh Chih; Rogers, John A.; Huang, Yonggang.

In: Journal of Applied Physics, Vol. 114, No. 16, 164511, 28.10.2013.

Research output: Contribution to journalArticle

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AU - Su, Yewang

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AU - Rogers, John A.

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AB - Tactile sensors and electrotactile stimulators can provide important links between humans and virtual environments, through the sensation of touch. Soft materials, such as low modulus silicones, are attractive as platforms and support matrices for arrays sensors and actuators that laminate directly onto the fingertips. Analytic models for the mechanics of three dimensional, form-fitting finger cuffs based on such designs are presented here, along with quantitative validation using the finite element method. The results indicate that the maximum strains in the silicone and the embedded devices are inversely proportional to the square root of radius of curvature of the cuff. These and other findings can be useful in formulating designs for these and related classes of body-worn, three dimensional devices.

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Su Y, Li R, Cheng H, Ying M, Bonifas AP, Hwang KC et al. Mechanics of finger-tip electronics. Journal of Applied Physics. 2013 Oct 28;114(16). 164511. https://doi.org/10.1063/1.4828476