MEMS lubrication by tribochemical reaction

Michael T. Dugger, James A. Ohlhausen, David B. Asay, Seong H. Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A means of providing replenishable lubrication to rubbing silicon surfaces is demonstrated. Alcohol at a small fraction of saturation vapor pressure is introduced in a nitrogen environment. Pin-on-flat sliding experiments in this environment reveal a friction coefficient near 0.2, and absence of wear above a critical alcohol concentration. This lubrication approach was also demonstrated in microfabricated silicon machines, where the devices operated at least a factor of 104 longer without failure when alcohol vapor was present in the nitrogen gas environment, compared to devices in dry N2 with a chemisorbed monolayer alone. When water vapor was added to the environment, vapor lubrication by alcohol was inhibited at concentration ratios of water: alcohol = 2.5:1.

Original languageEnglish (US)
Title of host publication2007 Proceedings of the ASME/STLE International Joint Tribology Conference, IJTC 2007
Pages873-875
Number of pages3
DOIs
StatePublished - May 19 2008
Event2007 ASME/STLE International Joint Tribology Conference, IJTC 2007 - San Diego, CA, United States
Duration: Oct 22 2007Oct 24 2007

Publication series

Name2007 Proceedings of the ASME/STLE International Joint Tribology Conference, IJTC 2007
VolumePART B

Other

Other2007 ASME/STLE International Joint Tribology Conference, IJTC 2007
CountryUnited States
CitySan Diego, CA
Period10/22/0710/24/07

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Surfaces, Coatings and Films
  • Condensed Matter Physics
  • Surfaces and Interfaces

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    Dugger, M. T., Ohlhausen, J. A., Asay, D. B., & Kim, S. H. (2008). MEMS lubrication by tribochemical reaction. In 2007 Proceedings of the ASME/STLE International Joint Tribology Conference, IJTC 2007 (pp. 873-875). (2007 Proceedings of the ASME/STLE International Joint Tribology Conference, IJTC 2007; Vol. PART B). https://doi.org/10.1115/IJTC2007-44308