Meta-materials concepts in high-frequency applications

M. Wilhelm, R. Taylor, K. Church, Douglas Henry Werner

Research output: Contribution to conferencePaper

Abstract

The electronics world has continued to push for reduction of physical size in terms of individual components and total package dimensions. In most cases, this size reduction has been accomplished without sacrificing quality or functionality. Conversely, the antenna structures from which many of these electronics packages will send or receive signals has not kept pace with the overall trend of reduction in physical size. Now, however, the application of meta-material concepts to high-frequency radiating structures and the substrates supporting these structures is enabling a reduction in the physical size of these elements. The size reduction is being accomplished without degradation of element performance; in some cases, it has enabled enhanced characteristics. An overview of these reduced-size structures is presented.

Original languageEnglish (US)
StatePublished - Dec 1 2002
Event2002 45th Midwest Symposium on Circuits and Systems - Tulsa, OK, United States
Duration: Aug 4 2002Aug 7 2002

Other

Other2002 45th Midwest Symposium on Circuits and Systems
CountryUnited States
CityTulsa, OK
Period8/4/028/7/02

Fingerprint

Electronic equipment
Antennas
Degradation
Substrates

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Wilhelm, M., Taylor, R., Church, K., & Werner, D. H. (2002). Meta-materials concepts in high-frequency applications. Paper presented at 2002 45th Midwest Symposium on Circuits and Systems, Tulsa, OK, United States.
Wilhelm, M. ; Taylor, R. ; Church, K. ; Werner, Douglas Henry. / Meta-materials concepts in high-frequency applications. Paper presented at 2002 45th Midwest Symposium on Circuits and Systems, Tulsa, OK, United States.
@conference{1af7bb27a35348f9902d5397402ef1bb,
title = "Meta-materials concepts in high-frequency applications",
abstract = "The electronics world has continued to push for reduction of physical size in terms of individual components and total package dimensions. In most cases, this size reduction has been accomplished without sacrificing quality or functionality. Conversely, the antenna structures from which many of these electronics packages will send or receive signals has not kept pace with the overall trend of reduction in physical size. Now, however, the application of meta-material concepts to high-frequency radiating structures and the substrates supporting these structures is enabling a reduction in the physical size of these elements. The size reduction is being accomplished without degradation of element performance; in some cases, it has enabled enhanced characteristics. An overview of these reduced-size structures is presented.",
author = "M. Wilhelm and R. Taylor and K. Church and Werner, {Douglas Henry}",
year = "2002",
month = "12",
day = "1",
language = "English (US)",
note = "2002 45th Midwest Symposium on Circuits and Systems ; Conference date: 04-08-2002 Through 07-08-2002",

}

Wilhelm, M, Taylor, R, Church, K & Werner, DH 2002, 'Meta-materials concepts in high-frequency applications' Paper presented at 2002 45th Midwest Symposium on Circuits and Systems, Tulsa, OK, United States, 8/4/02 - 8/7/02, .

Meta-materials concepts in high-frequency applications. / Wilhelm, M.; Taylor, R.; Church, K.; Werner, Douglas Henry.

2002. Paper presented at 2002 45th Midwest Symposium on Circuits and Systems, Tulsa, OK, United States.

Research output: Contribution to conferencePaper

TY - CONF

T1 - Meta-materials concepts in high-frequency applications

AU - Wilhelm, M.

AU - Taylor, R.

AU - Church, K.

AU - Werner, Douglas Henry

PY - 2002/12/1

Y1 - 2002/12/1

N2 - The electronics world has continued to push for reduction of physical size in terms of individual components and total package dimensions. In most cases, this size reduction has been accomplished without sacrificing quality or functionality. Conversely, the antenna structures from which many of these electronics packages will send or receive signals has not kept pace with the overall trend of reduction in physical size. Now, however, the application of meta-material concepts to high-frequency radiating structures and the substrates supporting these structures is enabling a reduction in the physical size of these elements. The size reduction is being accomplished without degradation of element performance; in some cases, it has enabled enhanced characteristics. An overview of these reduced-size structures is presented.

AB - The electronics world has continued to push for reduction of physical size in terms of individual components and total package dimensions. In most cases, this size reduction has been accomplished without sacrificing quality or functionality. Conversely, the antenna structures from which many of these electronics packages will send or receive signals has not kept pace with the overall trend of reduction in physical size. Now, however, the application of meta-material concepts to high-frequency radiating structures and the substrates supporting these structures is enabling a reduction in the physical size of these elements. The size reduction is being accomplished without degradation of element performance; in some cases, it has enabled enhanced characteristics. An overview of these reduced-size structures is presented.

UR - http://www.scopus.com/inward/record.url?scp=0036979342&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0036979342&partnerID=8YFLogxK

M3 - Paper

ER -

Wilhelm M, Taylor R, Church K, Werner DH. Meta-materials concepts in high-frequency applications. 2002. Paper presented at 2002 45th Midwest Symposium on Circuits and Systems, Tulsa, OK, United States.