Meta-materials concepts in high-frequency applications

M. Wilhelm, R. Taylor, K. Church, D. Werner

Research output: Contribution to conferencePaper

Abstract

The electronics world has continued to push for reduction of physical size in terms of individual components and total package dimensions. In most cases, this size reduction has been accomplished without sacrificing quality or functionality. Conversely, the antenna structures from which many of these electronics packages will send or receive signals has not kept pace with the overall trend of reduction in physical size. Now, however, the application of meta-material concepts to high-frequency radiating structures and the substrates supporting these structures is enabling a reduction in the physical size of these elements. The size reduction is being accomplished without degradation of element performance; in some cases, it has enabled enhanced characteristics. An overview of these reduced-size structures is presented.

Original languageEnglish (US)
PagesII637-II640
StatePublished - Dec 1 2002
Event2002 45th Midwest Symposium on Circuits and Systems - Tulsa, OK, United States
Duration: Aug 4 2002Aug 7 2002

Other

Other2002 45th Midwest Symposium on Circuits and Systems
CountryUnited States
CityTulsa, OK
Period8/4/028/7/02

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Wilhelm, M., Taylor, R., Church, K., & Werner, D. (2002). Meta-materials concepts in high-frequency applications. II637-II640. Paper presented at 2002 45th Midwest Symposium on Circuits and Systems, Tulsa, OK, United States.