Metallization of a polymer substrate for microfluidic-cooled RF laminates

Stephen Long, W. Mark Dorsey, André A. Adams, Gregory Huff

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new method for metallization of a polymer substrate has been demonstrated. This method allows for RF devices, including integrated circuits, to be fabricated on substrates which may feature microfluidic channels for cooling. Conventional hot-embossing was used to integrate copper mesh into a poly(methyl methacrylate) (PMMA), forming a microwave laminate. The laminate was machined into a microstrip patch antenna with a resonant frequency of 2.916 GHz.

Original languageEnglish (US)
Title of host publicationICICDT 2014 - IEEE International Conference on Integrated Circuit Design and Technology
PublisherIEEE Computer Society
ISBN (Print)9781479921539
DOIs
Publication statusPublished - Jan 1 2014
Event2014 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT 2014 - Austin, TX, United States
Duration: May 28 2014May 30 2014

Publication series

NameICICDT 2014 - IEEE International Conference on Integrated Circuit Design and Technology

Conference

Conference2014 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT 2014
CountryUnited States
CityAustin, TX
Period5/28/145/30/14

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All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Long, S., Dorsey, W. M., Adams, A. A., & Huff, G. (2014). Metallization of a polymer substrate for microfluidic-cooled RF laminates. In ICICDT 2014 - IEEE International Conference on Integrated Circuit Design and Technology [6838591] (ICICDT 2014 - IEEE International Conference on Integrated Circuit Design and Technology). IEEE Computer Society. https://doi.org/10.1109/ICICDT.2014.6838591