Melting the surface of Ag-Cu specimens with a laser or electron beam produces a variety of microstructures, the most interesting being a banded structure. In this letter we present a method, based on the interface response functions for solidification developed by Aziz and Kaplan [Acta Metall. 36, 2335 (1988)], for calculating the scanning velocity of the beam needed to bypass the banded structure and solidify the alloy in a microsegregation-free manner. When this velocity has been determined experimentally, as in the present Ag-Cu system, the width of the solid-liquid interface can be estimated.
All Science Journal Classification (ASJC) codes
- Physics and Astronomy (miscellaneous)