Method for predicting microsegregation-free solidification with application to Ag-Cu alloys

E. Y. Yankov, M. I. Yankova, S. M. Copley, Judith Todd Copley

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Abstract

Melting the surface of Ag-Cu specimens with a laser or electron beam produces a variety of microstructures, the most interesting being a banded structure. In this letter we present a method, based on the interface response functions for solidification developed by Aziz and Kaplan [Acta Metall. 36, 2335 (1988)], for calculating the scanning velocity of the beam needed to bypass the banded structure and solidify the alloy in a microsegregation-free manner. When this velocity has been determined experimentally, as in the present Ag-Cu system, the width of the solid-liquid interface can be estimated.

Original languageEnglish (US)
Pages (from-to)2106-2108
Number of pages3
JournalApplied Physics Letters
Volume59
Issue number17
DOIs
Publication statusPublished - Dec 1 1991

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All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

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