Microbridge testing of thin films under small deformation

T. Y. Zhang, Y. J. Su, C. F. Qian, M. H. Zhao, L. Q. Chen

Research output: Contribution to journalConference articlepeer-review

5 Scopus citations

Abstract

The present work proposes a novel microbridge testing method to simultaneously evaluate the Young's modulus, residual stress of thin films under small deformation. Theoretic analysis and finite element calculation are conducted on microbridge deformation to provide a closed formula of deflection versus load, considering both substrate deformation and residual stress in the film. Silicon nitride films fabricated by low pressure chemical vapor deposition on silicon substrates are tested to demonstrate the proposed method. The results show that the Young's modulus and residual stress for the annealed silicon nitride film are respectively 202 GPa and 334.9 MPa.

Original languageEnglish (US)
Pages (from-to)477-482
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume594
StatePublished - Dec 11 2000
EventThin Films-Stress and Machanical Properties VIII - Boston, MA, USA
Duration: Nov 29 1999Dec 3 1999

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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