Micron scale conductors and integrated passives in LTCC's by electrophoretic deposition

Jonathan J. Van Tassel, Clive A. Randall

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Electrophoretic deposition (EPD) is a low cost, particle based, electrodynamic forming process suitable for particles in the micron to nanometer size range. It can be used to reproduce patterns of conductor or dielectric material with micron scale resolution. This can be applied to the miniaturization of interconnects and components incorporated into low temperature co-fired ceramic modules. The process for forming these patterns is as follows. First, a conductive pattern is imaged by conventional photolithography on a plastic film. This pattern can then be coated with particles by EPD. Using a binder, this deposited particulate pattern can be transferred to another surface, where it can be sintered or fused to make continuous conductor lines, dielectric patches or layers with micron scale vias. The photolithographically produced conductor pattern can then be re-used repeatedly to create more patterned particulate depositions. In this manner a single pattern produced by photolithography can be used to make multiple parts with photolithographic scale resolution. Using this process we have created 5 μmwide silver conductor lines on a 10 μm spacing, layers with 5 μmdiameter vias, and 600 nm thick barium titanate dielectric layers.

Original languageEnglish (US)
Title of host publicationProceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005
Pages190-193
Number of pages4
StatePublished - Dec 1 2005
Event1st International Conference and Exhibition on Ceramic Microsystems Technologies, CICMT 2005 - Co-located with the 107th Annual Meeting of the American Ceramic Society, ACerS 2005 - Baltimore, MD, United States
Duration: Apr 10 2005Apr 13 2005

Publication series

NameProceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005

Other

Other1st International Conference and Exhibition on Ceramic Microsystems Technologies, CICMT 2005 - Co-located with the 107th Annual Meeting of the American Ceramic Society, ACerS 2005
CountryUnited States
CityBaltimore, MD
Period4/10/054/13/05

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Micron scale conductors and integrated passives in LTCC's by electrophoretic deposition'. Together they form a unique fingerprint.

  • Cite this

    Van Tassel, J. J., & Randall, C. A. (2005). Micron scale conductors and integrated passives in LTCC's by electrophoretic deposition. In Proceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005 (pp. 190-193). (Proceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005).