Microsample tensile testing of nanocrystalline copper

Y. M. Wang, K. Wang, D. Pan, K. Lu, K. J. Hemker, E. Ma

Research output: Contribution to journalArticlepeer-review

213 Scopus citations

Abstract

The tensile properties of nanocrystalline copper with grain sizes <100 nm produced by surface mechanical attrition treatment have been characterized using a microsample testing technique. The nanocrystalline copper exhibits a yield strength as high as 760 MPa, with a small elongation to failure. Factors leading to the high strength and low ductility are discussed.

Original languageEnglish (US)
Pages (from-to)1581-1586
Number of pages6
JournalScripta Materialia
Volume48
Issue number12
DOIs
StatePublished - Jun 2003

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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