Millimeter and submillimeter wave surface impedance of YBa2Cu3O7-δ thin films with reduced low temperature absorption

N. Klein, U. Dähne, U. Poppe, H. Soltner, B. Kabius, K. Urban, J. Schubert, W. Zander, S. Orbach, S. Hensen, G. Müller, H. Piel, B. P. Gorshunov, G. V. Kozlov, S. P. Lebedev, A. A. Volkov

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Abstract

The surface impedance of epitaxial YBa2Cu3O7-δ thin films prepared by high oxygen pressure dc sputtering as well as by excimer laser ablation on LaAlO3 has been measured at 87 GHz by a cavity endplate replacement technique and between 100GHz and 1THz by transmission experiments. Some of our films with low dc-resistivity values (ρ{variant}(100K)=40-50 μωcm, ρ{variant}(300K) ρ{variant}(100K)≥3 and improved microstructure exhibit besides the initial steep falloff at Tc a further gradual decrease of the surface resistance below about 50K by at least one order of magnitude, presently limited by the sensitivity of our measurement techniques. The dynamic conductivity determined from the surface impedance shows a maximum below Tc looking similar to a BCS coherence peak. Beyond the relevance for the understanding of the conduction mechanism our low loss films are important for millimeter- and submillimeter wave applications below Tc/2.

Original languageEnglish (US)
Pages (from-to)1777-1778
Number of pages2
JournalPhysica C: Superconductivity and its applications
Volume185-189
Issue numberPART 3
DOIs
StatePublished - Dec 1 1991

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

Cite this

Klein, N., Dähne, U., Poppe, U., Soltner, H., Kabius, B., Urban, K., Schubert, J., Zander, W., Orbach, S., Hensen, S., Müller, G., Piel, H., Gorshunov, B. P., Kozlov, G. V., Lebedev, S. P., & Volkov, A. A. (1991). Millimeter and submillimeter wave surface impedance of YBa2Cu3O7-δ thin films with reduced low temperature absorption. Physica C: Superconductivity and its applications, 185-189(PART 3), 1777-1778. https://doi.org/10.1016/0921-4534(91)91014-U