Mitigating electromigration of power supply networks using bidirectional current stress

Jing Xie, Vijaykrishnan Narayanan, Yuan Xie

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

Electromigration (EM) is one of the major reliability issues for IC designs. The EM effect is observed as the shape change of metal wires under uni-directional high density current. Such metal wire distortions could result in open-circuit failures or short-circuit failures for the interconnects in integrated circuits. The current density on power supply network is usually the highest one among all the on-chip interconnects, and the current direction on power rails seldom changes. Consequently, the power supply network is the most EM-vulnerable component on a chip. We propose a novel solution based on the electromigration AC healing effect to extend the lifetime of power supply networks. This solution uses simple control logics to apply balanced amount of current in both directions of power rails. Therefore, power wires can perform self-healing during function mode. This technique can be easily integrated into different package plans with small area and performance overhead. The post layout simulation shows 3X-10X increase of the mean time to failure (MTTF) for the power rails.

Original languageEnglish (US)
Title of host publicationGLSVLSI'12 - Proceedings of the Great Lakes Symposium on VLSI 2012
Pages299-302
Number of pages4
DOIs
StatePublished - May 22 2012
Event22nd Great Lakes Symposium on VLSI, GLSVLSI'2012 - Salt Lake City, UT, United States
Duration: May 3 2012May 4 2012

Other

Other22nd Great Lakes Symposium on VLSI, GLSVLSI'2012
CountryUnited States
CitySalt Lake City, UT
Period5/3/125/4/12

Fingerprint

Electromigration
Rails
Wire
Current density
Metals
Short circuit currents
Integrated circuits
Networks (circuits)

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Xie, J., Narayanan, V., & Xie, Y. (2012). Mitigating electromigration of power supply networks using bidirectional current stress. In GLSVLSI'12 - Proceedings of the Great Lakes Symposium on VLSI 2012 (pp. 299-302) https://doi.org/10.1145/2206781.2206854
Xie, Jing ; Narayanan, Vijaykrishnan ; Xie, Yuan. / Mitigating electromigration of power supply networks using bidirectional current stress. GLSVLSI'12 - Proceedings of the Great Lakes Symposium on VLSI 2012. 2012. pp. 299-302
@inproceedings{1672db4928e142e9be164d1c179469df,
title = "Mitigating electromigration of power supply networks using bidirectional current stress",
abstract = "Electromigration (EM) is one of the major reliability issues for IC designs. The EM effect is observed as the shape change of metal wires under uni-directional high density current. Such metal wire distortions could result in open-circuit failures or short-circuit failures for the interconnects in integrated circuits. The current density on power supply network is usually the highest one among all the on-chip interconnects, and the current direction on power rails seldom changes. Consequently, the power supply network is the most EM-vulnerable component on a chip. We propose a novel solution based on the electromigration AC healing effect to extend the lifetime of power supply networks. This solution uses simple control logics to apply balanced amount of current in both directions of power rails. Therefore, power wires can perform self-healing during function mode. This technique can be easily integrated into different package plans with small area and performance overhead. The post layout simulation shows 3X-10X increase of the mean time to failure (MTTF) for the power rails.",
author = "Jing Xie and Vijaykrishnan Narayanan and Yuan Xie",
year = "2012",
month = "5",
day = "22",
doi = "10.1145/2206781.2206854",
language = "English (US)",
isbn = "9781450312448",
pages = "299--302",
booktitle = "GLSVLSI'12 - Proceedings of the Great Lakes Symposium on VLSI 2012",

}

Xie, J, Narayanan, V & Xie, Y 2012, Mitigating electromigration of power supply networks using bidirectional current stress. in GLSVLSI'12 - Proceedings of the Great Lakes Symposium on VLSI 2012. pp. 299-302, 22nd Great Lakes Symposium on VLSI, GLSVLSI'2012, Salt Lake City, UT, United States, 5/3/12. https://doi.org/10.1145/2206781.2206854

Mitigating electromigration of power supply networks using bidirectional current stress. / Xie, Jing; Narayanan, Vijaykrishnan; Xie, Yuan.

GLSVLSI'12 - Proceedings of the Great Lakes Symposium on VLSI 2012. 2012. p. 299-302.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Mitigating electromigration of power supply networks using bidirectional current stress

AU - Xie, Jing

AU - Narayanan, Vijaykrishnan

AU - Xie, Yuan

PY - 2012/5/22

Y1 - 2012/5/22

N2 - Electromigration (EM) is one of the major reliability issues for IC designs. The EM effect is observed as the shape change of metal wires under uni-directional high density current. Such metal wire distortions could result in open-circuit failures or short-circuit failures for the interconnects in integrated circuits. The current density on power supply network is usually the highest one among all the on-chip interconnects, and the current direction on power rails seldom changes. Consequently, the power supply network is the most EM-vulnerable component on a chip. We propose a novel solution based on the electromigration AC healing effect to extend the lifetime of power supply networks. This solution uses simple control logics to apply balanced amount of current in both directions of power rails. Therefore, power wires can perform self-healing during function mode. This technique can be easily integrated into different package plans with small area and performance overhead. The post layout simulation shows 3X-10X increase of the mean time to failure (MTTF) for the power rails.

AB - Electromigration (EM) is one of the major reliability issues for IC designs. The EM effect is observed as the shape change of metal wires under uni-directional high density current. Such metal wire distortions could result in open-circuit failures or short-circuit failures for the interconnects in integrated circuits. The current density on power supply network is usually the highest one among all the on-chip interconnects, and the current direction on power rails seldom changes. Consequently, the power supply network is the most EM-vulnerable component on a chip. We propose a novel solution based on the electromigration AC healing effect to extend the lifetime of power supply networks. This solution uses simple control logics to apply balanced amount of current in both directions of power rails. Therefore, power wires can perform self-healing during function mode. This technique can be easily integrated into different package plans with small area and performance overhead. The post layout simulation shows 3X-10X increase of the mean time to failure (MTTF) for the power rails.

UR - http://www.scopus.com/inward/record.url?scp=84861181094&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84861181094&partnerID=8YFLogxK

U2 - 10.1145/2206781.2206854

DO - 10.1145/2206781.2206854

M3 - Conference contribution

SN - 9781450312448

SP - 299

EP - 302

BT - GLSVLSI'12 - Proceedings of the Great Lakes Symposium on VLSI 2012

ER -

Xie J, Narayanan V, Xie Y. Mitigating electromigration of power supply networks using bidirectional current stress. In GLSVLSI'12 - Proceedings of the Great Lakes Symposium on VLSI 2012. 2012. p. 299-302 https://doi.org/10.1145/2206781.2206854