Modeling of board-level package by Finite Element Analysis and laser interferometer measurements

Bo Zhang, Pin Kuan Liu, Han Ding, Wenwu Cao

Research output: Contribution to journalArticlepeer-review

14 Scopus citations

Abstract

Board-level package is a complicated multi-components structure. It can be simulated by an equivalent Finite Element Analysis (FEA) model of the board-level package, in which detailed layer structure of the Print Circuit Board (PCB), signal wires and through-holes were ignored. For this purpose, it is necessary to obtain the equivalent material properties of the board-level package. In this work, a laser-based interferometric technique was used to measure the modal parameters of the board-level package. By fitting the FEA results with the experimental results, we can obtain equivalent material properties of the board-level package by means of the Taguchi method. Four control factors (Young's modulus in the x and y direction, mass density and shear modulus in the xy plane) at three levels are explored and assigned to the columns of a L9(34) saturated orthogonal array. The so obtained equivalent parameters provided the best fit between the FEA results and the experimental observations.

Original languageEnglish (US)
Pages (from-to)1021-1027
Number of pages7
JournalMicroelectronics Reliability
Volume50
Issue number7
DOIs
StatePublished - Jul 2010

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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