TY - JOUR
T1 - Multi-channel signal-generator ASIC for acoustic holograms
AU - Song, Rui
AU - Richard, Grace
AU - Cheng, Christopher You Yee
AU - Teng, Lijun
AU - Qiu, Yongqiang
AU - Lavery, Martin Philip John
AU - Trolier-Mckinstry, Susan
AU - Cochran, Sandy
AU - Underwood, Ian
N1 - Funding Information:
Manuscript received June 27, 2019; accepted August 28, 2019. Date of publication September 2, 2019; date of current version December 26, 2019. This work was supported in part by the Center for Nanoscale Science, a Materials Research Science and Engineering Center (MRSEC) supported by the National Science Foundation under Grant DMR-1420620 and in part by the EPSRC Program Grant “Implantable Microsystems for Personalized Anticancer Therapy (IMPACT)” under Grant EP/K034510/1. The work of C. Cheng was supported by the National Defense Science and Engineering Graduate (NDSEG) Fellowship Program. The work of G. Richard and M. P. J. Lavery was supported by the Royal Academy of Engineering and the U.K. Engineering and Physical Sciences Research Council (EPSRC) under Grant EP/N032853/1. (Corresponding author: Rui Song.) R. Song, L. Teng, and I. Underwood are with the School of Engineering, University of Edinburgh, Edinburgh EH9 3FB, U.K. (e-mail: sr6800@live.com).
Funding Information:
Mr. Cheng is a National Defense Science and Engineering Graduate Fellow. He was a recipient of the National Science Foundation Graduate Research Fellow Award.
Publisher Copyright:
© 1986-2012 IEEE.
PY - 2020/1
Y1 - 2020/1
N2 - A complementary metal-oxide-semiconductor (CMOS) application-specific integrated circuit (ASIC) has been developed to generate arbitrary, dynamic phase patterns for acoustic hologram applications. An experimental prototype has been fabricated to demonstrate phase shaping. It comprises a cascadable 1 × 9 array of identical, independently controlled signal generators implemented in a 0.35-μm minimum-feature-size process. It can individually control the phase of a square wave on each of the nine output pads. The footprint of the integrated circuit is 1175 × 88 μm2. A 128-MHz clock frequency is used to produce outputs at 8 MHz with a phase resolution of 16 levels (4 bits) per channel. A 6 × 6 air-coupled matrix array ultrasonic transducer was built and driven by four ASICs, with the help of commercial buffer amplifiers, for the application demonstration. Acoustic pressure mapping and particle manipulation were performed. In addition, a 2 × 2 array piezoelectric micromachined ultrasonic transducer (PMUT) was connected and driven by four output channels of a single ASIC, demonstrating the flexibility of the ASIC to work with different transducers and the potential for direct integration of CMOS and PMUTs.
AB - A complementary metal-oxide-semiconductor (CMOS) application-specific integrated circuit (ASIC) has been developed to generate arbitrary, dynamic phase patterns for acoustic hologram applications. An experimental prototype has been fabricated to demonstrate phase shaping. It comprises a cascadable 1 × 9 array of identical, independently controlled signal generators implemented in a 0.35-μm minimum-feature-size process. It can individually control the phase of a square wave on each of the nine output pads. The footprint of the integrated circuit is 1175 × 88 μm2. A 128-MHz clock frequency is used to produce outputs at 8 MHz with a phase resolution of 16 levels (4 bits) per channel. A 6 × 6 air-coupled matrix array ultrasonic transducer was built and driven by four ASICs, with the help of commercial buffer amplifiers, for the application demonstration. Acoustic pressure mapping and particle manipulation were performed. In addition, a 2 × 2 array piezoelectric micromachined ultrasonic transducer (PMUT) was connected and driven by four output channels of a single ASIC, demonstrating the flexibility of the ASIC to work with different transducers and the potential for direct integration of CMOS and PMUTs.
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U2 - 10.1109/TUFFC.2019.2938917
DO - 10.1109/TUFFC.2019.2938917
M3 - Article
C2 - 31484116
AN - SCOPUS:85077295806
SN - 0885-3010
VL - 67
SP - 49
EP - 56
JO - IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
JF - IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
IS - 1
M1 - 8822495
ER -