Multi-physics of nanoscale thin films and interfaces

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present the design and fabrication of a microchip capable of performing mechanical (tensile, fracture, fatigue), electrical (conductivity and band gap) and thermal (conductivity and specific heat) characterization of materials and interfaces. The chip can study thin films and wires of any material that can be deposited on a substrate or study thin coupons if the specimen is in bulk form. The 3 mm x 3 mm size of the chip results in the unique capability of in-situ testing in analytical chambers such as the transmission electron microscope. The basic concept is to 'see' the micro-mechanisms while 'measuring' the deformation and transport properties of materials and interfaces. The advantage of such simultaneous acquisition of quantitative and qualitative data is the accurate and quick physics-based modeling of materials behavior. We present preliminary studies on multi-physics, or the coupling among mechanical thermal and electrical domains in materials will be presented. These results are particularly important when the specimen dimension becomes comparable to the mean free paths of electron and phonons.

Original languageEnglish (US)
Title of host publicationASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Pages375-379
Number of pages5
DOIs
StatePublished - Dec 1 2011
EventASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011 - Portland, OR, United States
Duration: Jul 6 2011Jul 8 2011

Publication series

NameASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Volume1

Other

OtherASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
CountryUnited States
CityPortland, OR
Period7/6/117/8/11

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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