Novel chip-scale high-g whispering gallery mode resonator as a magnetometer

Eugene Freeman, Cheng Yu Wang, Vedant Sumaria, Chenchen Zhang, Alexander Cocking, Zhiwen Liu, Srinivas Tadigadapa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

We present a novel magnetometer consisting of chip-scale whispering gallery mode resonators with high-g factors (>106) realized using MEMs fabrication techniques. A permanent magnet is elastically coupled to a whispering gallery mode borosilicate microbubble. Magnetic forces from applied external magnetic fields induce deformation in the microbubble which can be sensitively monitored through changes in the optical resonance characteristics. We calculate the force and simulate the resultant deformation in the microbubble. The effect of different permanent magnet orientations and microbubble shell thickness is experimentally investigated and modeled. We experimentally demonstrate a large sensitivity of 1.9 GHz/mT on a microbubble with 1.1 μm shell thickness.

Original languageEnglish (US)
Title of host publicationIEEE SENSORS 2017 - Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-3
Number of pages3
ISBN (Electronic)9781509010127
DOIs
StatePublished - Dec 21 2017
Event16th IEEE SENSORS Conference, ICSENS 2017 - Glasgow, United Kingdom
Duration: Oct 30 2017Nov 1 2017

Publication series

NameProceedings of IEEE Sensors
Volume2017-December
ISSN (Print)1930-0395
ISSN (Electronic)2168-9229

Other

Other16th IEEE SENSORS Conference, ICSENS 2017
CountryUnited Kingdom
CityGlasgow
Period10/30/1711/1/17

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Freeman, E., Wang, C. Y., Sumaria, V., Zhang, C., Cocking, A., Liu, Z., & Tadigadapa, S. (2017). Novel chip-scale high-g whispering gallery mode resonator as a magnetometer. In IEEE SENSORS 2017 - Conference Proceedings (pp. 1-3). (Proceedings of IEEE Sensors; Vol. 2017-December). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSENS.2017.8233893