Novel piezoelectric polyimide MEMS

G. M. Atkinson, R. E. Pearson, Z. Ounaies, C. Park, J. S. Harrison, S. Dogan, J. A. Midkiff

Research output: Chapter in Book/Report/Conference proceedingConference contribution

18 Citations (Scopus)

Abstract

We have demonstrated a fabrication process for fabricating MEMS cantilever and bridge structures using a novel high-temperature piezoelectric polyimide as the structural material. The process consists of conventional lithography and metallization processes and uses a sacrificial layer of photoresist. Electrodes are fabricated on the upper and lower surfaces of the suspended structures and a self-test electrode is fabricated underlying each suspended component for testing. Particular attention is paid to the baking and curing of the polymer films used for structural, sacrificial and lithography layers in order to maintain the structural integrity of the devices throughout the fabrication process. A key aspect to accomplishing this is the use of a chemically imidized polyimide solution to eliminate the high curing temperature normally required to form polyimide. Using this approach, the entire process sequence, through the removal of the sacrificial layer, is kept below 125°C. This process has application to building a variety of microelectromechanical sensors and actuators.

Original languageEnglish (US)
Title of host publicationTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages782-785
Number of pages4
ISBN (Electronic)0780377311, 9780780377318
DOIs
StatePublished - Jan 1 2003
Event12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers - Boston, United States
Duration: Jun 8 2003Jun 12 2003

Publication series

NameTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
Volume1

Other

Other12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers
CountryUnited States
CityBoston
Period6/8/036/12/03

Fingerprint

Polyimides
MEMS
Lithography
Curing
Fabrication
Electrodes
Structural integrity
Photoresists
Metallizing
Polymer films
Actuators
Temperature
Sensors
Testing

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Atkinson, G. M., Pearson, R. E., Ounaies, Z., Park, C., Harrison, J. S., Dogan, S., & Midkiff, J. A. (2003). Novel piezoelectric polyimide MEMS. In TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers (pp. 782-785). [1215590] (TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers; Vol. 1). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SENSOR.2003.1215590
Atkinson, G. M. ; Pearson, R. E. ; Ounaies, Z. ; Park, C. ; Harrison, J. S. ; Dogan, S. ; Midkiff, J. A. / Novel piezoelectric polyimide MEMS. TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2003. pp. 782-785 (TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers).
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Atkinson, GM, Pearson, RE, Ounaies, Z, Park, C, Harrison, JS, Dogan, S & Midkiff, JA 2003, Novel piezoelectric polyimide MEMS. in TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers., 1215590, TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers, vol. 1, Institute of Electrical and Electronics Engineers Inc., pp. 782-785, 12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers, Boston, United States, 6/8/03. https://doi.org/10.1109/SENSOR.2003.1215590

Novel piezoelectric polyimide MEMS. / Atkinson, G. M.; Pearson, R. E.; Ounaies, Z.; Park, C.; Harrison, J. S.; Dogan, S.; Midkiff, J. A.

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc., 2003. p. 782-785 1215590 (TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers; Vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - We have demonstrated a fabrication process for fabricating MEMS cantilever and bridge structures using a novel high-temperature piezoelectric polyimide as the structural material. The process consists of conventional lithography and metallization processes and uses a sacrificial layer of photoresist. Electrodes are fabricated on the upper and lower surfaces of the suspended structures and a self-test electrode is fabricated underlying each suspended component for testing. Particular attention is paid to the baking and curing of the polymer films used for structural, sacrificial and lithography layers in order to maintain the structural integrity of the devices throughout the fabrication process. A key aspect to accomplishing this is the use of a chemically imidized polyimide solution to eliminate the high curing temperature normally required to form polyimide. Using this approach, the entire process sequence, through the removal of the sacrificial layer, is kept below 125°C. This process has application to building a variety of microelectromechanical sensors and actuators.

AB - We have demonstrated a fabrication process for fabricating MEMS cantilever and bridge structures using a novel high-temperature piezoelectric polyimide as the structural material. The process consists of conventional lithography and metallization processes and uses a sacrificial layer of photoresist. Electrodes are fabricated on the upper and lower surfaces of the suspended structures and a self-test electrode is fabricated underlying each suspended component for testing. Particular attention is paid to the baking and curing of the polymer films used for structural, sacrificial and lithography layers in order to maintain the structural integrity of the devices throughout the fabrication process. A key aspect to accomplishing this is the use of a chemically imidized polyimide solution to eliminate the high curing temperature normally required to form polyimide. Using this approach, the entire process sequence, through the removal of the sacrificial layer, is kept below 125°C. This process has application to building a variety of microelectromechanical sensors and actuators.

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Atkinson GM, Pearson RE, Ounaies Z, Park C, Harrison JS, Dogan S et al. Novel piezoelectric polyimide MEMS. In TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. Institute of Electrical and Electronics Engineers Inc. 2003. p. 782-785. 1215590. (TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers). https://doi.org/10.1109/SENSOR.2003.1215590