NZP: A new family of low-thermal expansion materials

Dinesh Kumar Agrawal, C. Y. Huang, H. A. McKinstry

Research output: Contribution to journalArticle

37 Citations (Scopus)

Abstract

A new structural family of low-expansion materials known as NZP has been recently discovered and has generated great interest for wide-ranging applications such as fast ionic conductors, devices requiring good thermal shock resistance, hosts for nuclear wastes, catalyst supports in automobiles, etc. This family is derived from the prototype composition NaZr2P2O12 in which various ionic substitutions can be made leading to numerous new compositions. The bulk thermal expansion of these materials varies from low negative to low positive values and can be controlled and tailored to suit the needs for specific applications. In general, most of the NZP members demonstrate an anisotropy in their lattice thermal expansions, which is the main cause of the low-thermal expansion behavior of these materials. In CaZr4P6O24 and SrZr4P6O24 an opposite anisotropy has been observed which has led to the development of near-zero expansion crystalline solution composition. On the basis of the coupled rotations of the polyhedral network formed by ZrO6 octahedra and PO4 tetrahedra, a crystal structure model to interpret and explain the thermal expansion behavior has been discussed.

Original languageEnglish (US)
Pages (from-to)697-710
Number of pages14
JournalInternational Journal of Thermophysics
Volume12
Issue number4
DOIs
StatePublished - Jul 1 1991

Fingerprint

thermal expansion
shock resistance
anisotropy
expansion
thermal shock
automobiles
radioactive wastes
tetrahedrons
conductors
prototypes
substitutes
catalysts
crystal structure
causes

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics

Cite this

Agrawal, Dinesh Kumar ; Huang, C. Y. ; McKinstry, H. A. / NZP : A new family of low-thermal expansion materials. In: International Journal of Thermophysics. 1991 ; Vol. 12, No. 4. pp. 697-710.
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NZP : A new family of low-thermal expansion materials. / Agrawal, Dinesh Kumar; Huang, C. Y.; McKinstry, H. A.

In: International Journal of Thermophysics, Vol. 12, No. 4, 01.07.1991, p. 697-710.

Research output: Contribution to journalArticle

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