Oblique incidence feature mapping techniques for the NDE of adhesive bonds

J. L. Rose, J. Dale, K. Balasubramaniam, A. Pilarski

Research output: Contribution to conferencePaper

1 Citation (Scopus)

Abstract

The Oblique Incidence technique proposed here, utilizes shear waves, obliquely incident upon an interface, in a physically based feature analysis process. Guidelines for the data collection process are selected from numerically established reflection factor curves using a theoretical model of the interface between two solid materials with different rigidities of connection. The additional sensitivity of the shear waves can be anticipated from the existence of the tangential components of displacements which are more sensitive to interfacial weaknesses. Also the frequency and angle dependence of the reflectivity from an imperfect interface has led us to the possibility of using the relevant feature combinations as dictated by our model.

Original languageEnglish (US)
Pages79-85
Number of pages7
StatePublished - Dec 1 1988
EventAdvances in Adhesively Bonded Joints - Chicago, IL, USA
Duration: Nov 27 1988Dec 2 1988

Other

OtherAdvances in Adhesively Bonded Joints
CityChicago, IL, USA
Period11/27/8812/2/88

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Shear waves
Adhesives
Rigidity

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Rose, J. L., Dale, J., Balasubramaniam, K., & Pilarski, A. (1988). Oblique incidence feature mapping techniques for the NDE of adhesive bonds. 79-85. Paper presented at Advances in Adhesively Bonded Joints, Chicago, IL, USA, .
Rose, J. L. ; Dale, J. ; Balasubramaniam, K. ; Pilarski, A. / Oblique incidence feature mapping techniques for the NDE of adhesive bonds. Paper presented at Advances in Adhesively Bonded Joints, Chicago, IL, USA, .7 p.
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Rose, JL, Dale, J, Balasubramaniam, K & Pilarski, A 1988, 'Oblique incidence feature mapping techniques for the NDE of adhesive bonds', Paper presented at Advances in Adhesively Bonded Joints, Chicago, IL, USA, 11/27/88 - 12/2/88 pp. 79-85.

Oblique incidence feature mapping techniques for the NDE of adhesive bonds. / Rose, J. L.; Dale, J.; Balasubramaniam, K.; Pilarski, A.

1988. 79-85 Paper presented at Advances in Adhesively Bonded Joints, Chicago, IL, USA, .

Research output: Contribution to conferencePaper

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Rose JL, Dale J, Balasubramaniam K, Pilarski A. Oblique incidence feature mapping techniques for the NDE of adhesive bonds. 1988. Paper presented at Advances in Adhesively Bonded Joints, Chicago, IL, USA, .