On-board fiber alignment in LTCC optoelectronic packages

Richard Eitel, Amanda Baker, Jose Agraz, Michael T. Lanagan, Kenji Uchino, Clive A. Randall

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Fiber to source/receiver alignment is currently a major issue for the optoelectronics industry. Alignment tolerances for high speed optical networking require sub-micrometer precision. Currently, the alignment process, rework and low yields due to misalignment add nearly an order of magnitude to the cost of optoelectronics modules. New methods are clearly needed to address this growing problem. Previous efforts at Penn State had focused on the application of Low Temperature Co-fire Ceramic (LTCC) materials for the construction of optoelectronic modules. This work evaluated the current and next generation LTCC technologies in terms of process control and material performance. While it was determined that these technologies promise dimensional controls approaching 10 um this alone is not sufficient to meet requirements for optoelectronic modules. Recently, our approach has focused on the integration of low cost piezoelectric actuators in oil-board LTCC alignment structures for either active or passive optical fiber alignment.

Original languageEnglish (US)
Title of host publicationProceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005
Pages20-24
Number of pages5
StatePublished - Dec 1 2005
Event1st International Conference and Exhibition on Ceramic Microsystems Technologies, CICMT 2005 - Co-located with the 107th Annual Meeting of the American Ceramic Society, ACerS 2005 - Baltimore, MD, United States
Duration: Apr 10 2005Apr 13 2005

Publication series

NameProceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005

Other

Other1st International Conference and Exhibition on Ceramic Microsystems Technologies, CICMT 2005 - Co-located with the 107th Annual Meeting of the American Ceramic Society, ACerS 2005
CountryUnited States
CityBaltimore, MD
Period4/10/054/13/05

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All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Materials Chemistry

Cite this

Eitel, R., Baker, A., Agraz, J., Lanagan, M. T., Uchino, K., & Randall, C. A. (2005). On-board fiber alignment in LTCC optoelectronic packages. In Proceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005 (pp. 20-24). (Proceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005).