On the assessment of voids in the thermal interface material on the thermal performance of a silicon chip package

Physics & Astronomy

• air 12%
• chips 83%
• performance 46%
• silicon 56%
• simulation 8%
• thermal conductivity 33%
• thermal resistance 23%
• voids 92%

Chemical Compounds

• Simulation 33%
• Thermal Conductivity 100%
• Thermal Resistance 64%
• Time 19%
• Volume 30%

Engineering & Materials Science

• Air 8%
• Analytical models 25%
• Computer simulation 8%
• Heat resistance 15%
• Hot Temperature 50%
• Numerical models 24%
• Silicon 83%
• Thermal conductivity 27%