Optimal constrained adjustments for quality control

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

This paper considers the optimal adjustment of a production process under fixed adjustment and quadratic off-target quality costs, when the magnitude of the adjustment is constrained to lie within certain upper bound. The process model is that of the Box and Jenkins' 'machine tool' problem. Formulas for both end of run and long-run adjustment limits are presented. It is shown that unless the adjustment is severely constrained, in most cases the unconstrained limits are nearly as good as the considered optimal limits. Cases when the constrained solution is more economical are discussed. This includes applications in semiconductor manufacturing. An example from a chemical-mechanical wafer polishing process illustrates the use of the constrained optimal adjustment limits.

Original languageEnglish (US)
Pages (from-to)2445-2458
Number of pages14
JournalInternational Journal of Production Research
Volume35
Issue number9
DOIs
StatePublished - Jan 1 1997

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Polishing
Machine tools
Quality control
Semiconductor materials
Costs

All Science Journal Classification (ASJC) codes

  • Strategy and Management
  • Management Science and Operations Research
  • Industrial and Manufacturing Engineering

Cite this

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abstract = "This paper considers the optimal adjustment of a production process under fixed adjustment and quadratic off-target quality costs, when the magnitude of the adjustment is constrained to lie within certain upper bound. The process model is that of the Box and Jenkins' 'machine tool' problem. Formulas for both end of run and long-run adjustment limits are presented. It is shown that unless the adjustment is severely constrained, in most cases the unconstrained limits are nearly as good as the considered optimal limits. Cases when the constrained solution is more economical are discussed. This includes applications in semiconductor manufacturing. An example from a chemical-mechanical wafer polishing process illustrates the use of the constrained optimal adjustment limits.",
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Optimal constrained adjustments for quality control. / Del Castillo, Enrique.

In: International Journal of Production Research, Vol. 35, No. 9, 01.01.1997, p. 2445-2458.

Research output: Contribution to journalArticle

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