Optimization of a pin-fin sink: a design tool

Research output: Contribution to conferencePaper

10 Citations (Scopus)

Abstract

Large power densities and increasing heat fluxes in microelectronics have resulted in the need for thermal enhancement strategies. Attachment of heat sinks has been shown to be a very cost effective heat removal technique. However, the design of heat sinks with multiple fins has been largely based on a make-and-test basis. Here, a design tool based on mathematical modelling and the use of optimization techniques is developed. The computer program can be used by designers to optimize the dimensions of the fins, assess the impact of increasing the number of fins or of many other parameters. The heat transfer coefficient is obtained using empirical correlations. A finite difference model has been developed, and the ellipsoid algorithm is used for optimization. Inputs to the program relate to the basic footprint of the heat sink: area, material properties, air flow and ambient temperatures, etc. The outputs are the fin height, width, spacing and minimized temperature distribution.

Original languageEnglish (US)
Pages25-32
Number of pages8
StatePublished - Dec 1 1994
EventProceedings of the 1994 International Mechanical Engineering Congress and Exposition - Chicago, IL, USA
Duration: Nov 6 1994Nov 11 1994

Other

OtherProceedings of the 1994 International Mechanical Engineering Congress and Exposition
CityChicago, IL, USA
Period11/6/9411/11/94

Fingerprint

Heat sinks
Fins (heat exchange)
Microelectronics
Heat transfer coefficients
Heat flux
Computer program listings
Materials properties
Temperature distribution
Air
Costs
Temperature
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Constans, E. W., Belegundu, A. D., & Kulkarni, A. K. (1994). Optimization of a pin-fin sink: a design tool. 25-32. Paper presented at Proceedings of the 1994 International Mechanical Engineering Congress and Exposition, Chicago, IL, USA, .
Constans, E. W. ; Belegundu, A. D. ; Kulkarni, A. K. / Optimization of a pin-fin sink : a design tool. Paper presented at Proceedings of the 1994 International Mechanical Engineering Congress and Exposition, Chicago, IL, USA, .8 p.
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year = "1994",
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Constans, EW, Belegundu, AD & Kulkarni, AK 1994, 'Optimization of a pin-fin sink: a design tool', Paper presented at Proceedings of the 1994 International Mechanical Engineering Congress and Exposition, Chicago, IL, USA, 11/6/94 - 11/11/94 pp. 25-32.

Optimization of a pin-fin sink : a design tool. / Constans, E. W.; Belegundu, A. D.; Kulkarni, A. K.

1994. 25-32 Paper presented at Proceedings of the 1994 International Mechanical Engineering Congress and Exposition, Chicago, IL, USA, .

Research output: Contribution to conferencePaper

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T1 - Optimization of a pin-fin sink

T2 - a design tool

AU - Constans, E. W.

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AB - Large power densities and increasing heat fluxes in microelectronics have resulted in the need for thermal enhancement strategies. Attachment of heat sinks has been shown to be a very cost effective heat removal technique. However, the design of heat sinks with multiple fins has been largely based on a make-and-test basis. Here, a design tool based on mathematical modelling and the use of optimization techniques is developed. The computer program can be used by designers to optimize the dimensions of the fins, assess the impact of increasing the number of fins or of many other parameters. The heat transfer coefficient is obtained using empirical correlations. A finite difference model has been developed, and the ellipsoid algorithm is used for optimization. Inputs to the program relate to the basic footprint of the heat sink: area, material properties, air flow and ambient temperatures, etc. The outputs are the fin height, width, spacing and minimized temperature distribution.

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Constans EW, Belegundu AD, Kulkarni AK. Optimization of a pin-fin sink: a design tool. 1994. Paper presented at Proceedings of the 1994 International Mechanical Engineering Congress and Exposition, Chicago, IL, USA, .