Options in nondestructive testing of components and PCB's

Dean F. Poeth, Charles E. Bakis

Research output: Contribution to journalArticlepeer-review

Abstract

The feasibility and necessity of in-process nondestructive testing is gaining widespread acceptance. NDT procedures are used when traditional testing and inspection result in an unwanted destruction of the part (e.g., testing a fuse), or are impractical (as in the disassembly of a potted circuit). Numerous NDT methods have been developed to evaluate bare and populated printed circuit boards (PCB's) and components, the most common of which are described.

Original languageEnglish (US)
Pages (from-to)28-32
Number of pages5
JournalElectronic manufacturing
Volume36
Issue number3
StatePublished - Mar 1 1990

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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