The feasibility and necessity of in-process nondestructive testing is gaining widespread acceptance. NDT procedures are used when traditional testing and inspection result in an unwanted destruction of the part (e.g., testing a fuse), or are impractical (as in the disassembly of a potted circuit). Numerous NDT methods have been developed to evaluate bare and populated printed circuit boards (PCB's) and components, the most common of which are described.
|Original language||English (US)|
|Number of pages||5|
|State||Published - Mar 1 1990|
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