Options in nondestructive testing of components and PCB's

Dean F. Poeth, Charles E. Bakis

Research output: Contribution to journalArticle

Abstract

The feasibility and necessity of in-process nondestructive testing is gaining widespread acceptance. NDT procedures are used when traditional testing and inspection result in an unwanted destruction of the part (e.g., testing a fuse), or are impractical (as in the disassembly of a potted circuit). Numerous NDT methods have been developed to evaluate bare and populated printed circuit boards (PCB's) and components, the most common of which are described.

Original languageEnglish (US)
Pages (from-to)28-32
Number of pages5
JournalElectronic manufacturing
Volume36
Issue number3
StatePublished - Mar 1 1990

Fingerprint

Nondestructive examination
Printed circuit boards
Testing
Electric fuses
Inspection
Networks (circuits)

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

@article{37fce506862b4b388ccbc5e44bf7a95d,
title = "Options in nondestructive testing of components and PCB's",
abstract = "The feasibility and necessity of in-process nondestructive testing is gaining widespread acceptance. NDT procedures are used when traditional testing and inspection result in an unwanted destruction of the part (e.g., testing a fuse), or are impractical (as in the disassembly of a potted circuit). Numerous NDT methods have been developed to evaluate bare and populated printed circuit boards (PCB's) and components, the most common of which are described.",
author = "Poeth, {Dean F.} and Bakis, {Charles E.}",
year = "1990",
month = "3",
day = "1",
language = "English (US)",
volume = "36",
pages = "28--32",
journal = "Electronic manufacturing",
issn = "0895-3708",
number = "3",

}

Options in nondestructive testing of components and PCB's. / Poeth, Dean F.; Bakis, Charles E.

In: Electronic manufacturing, Vol. 36, No. 3, 01.03.1990, p. 28-32.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Options in nondestructive testing of components and PCB's

AU - Poeth, Dean F.

AU - Bakis, Charles E.

PY - 1990/3/1

Y1 - 1990/3/1

N2 - The feasibility and necessity of in-process nondestructive testing is gaining widespread acceptance. NDT procedures are used when traditional testing and inspection result in an unwanted destruction of the part (e.g., testing a fuse), or are impractical (as in the disassembly of a potted circuit). Numerous NDT methods have been developed to evaluate bare and populated printed circuit boards (PCB's) and components, the most common of which are described.

AB - The feasibility and necessity of in-process nondestructive testing is gaining widespread acceptance. NDT procedures are used when traditional testing and inspection result in an unwanted destruction of the part (e.g., testing a fuse), or are impractical (as in the disassembly of a potted circuit). Numerous NDT methods have been developed to evaluate bare and populated printed circuit boards (PCB's) and components, the most common of which are described.

UR - http://www.scopus.com/inward/record.url?scp=0025403186&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0025403186&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0025403186

VL - 36

SP - 28

EP - 32

JO - Electronic manufacturing

JF - Electronic manufacturing

SN - 0895-3708

IS - 3

ER -