Oxidation of silicon surface with atomic oxygen radical anions

Lian Wang, Chong Fu Song, Jian Qiu Sun, Ying Hou, Xiao Guang Li, Quan Xin Li

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3 Scopus citations

Abstract

The surface oxidation of silicon (Si) wafers by atomic oxygen radical anions (O- anions) and the preparation of metal-oxide-semiconductor (MOS) capacitors on the O- -oxidized Si substrates have been examined for the first time. The O- anions are generated from a recently developed O- storage-emission material of [Ca24Al 28O64]4+.4O-(C12A7-O- for short). After it has been irradiated by an O- anion beam (0.5 μA/cm2) at 300°C for 1-10 hours, the Si wafer achieves an oxide layer with a thickness ranging from 8 to 32 nm. X-ray photoelectron spectroscopy (XPS) results reveal that the oxide layer is of a mixture of SiO2, Si2O3, and Si2O distributed in different oxidation depths. The features of the MOS capacitor of < Al electrode/SiOx/SI > are investigated by measuring capacitance-voltage (C - V) and current-voltage (I - V) curves. The oxide charge density is about 6.0 × 1011 cm-2 derived from the C - V curves. The leakage current density is in the order of 10 -6A/cm2 below 4MV/cm, obtained from the I - V curves. The O- anions formed by present method would have potential applications to the oxidation and the surface-modification of materials together with the preparation of semiconductor devices.

Original languageEnglish (US)
Pages (from-to)2197-2203
Number of pages7
JournalChinese Physics B
Volume17
Issue number6
DOIs
StatePublished - Jun 1 2008

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

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