Peel-And-stick: Mechanism study for efficient fabrication of flexible/ transparent thin-film electronics

Chi Hwan Lee, Jae Han Kim, Chenyu Zou, In Sun Cho, Jeffery M. Weisse, William Nemeth, Qi Wang, Adri Van Duin, Taek Soo Kim, Xiaolin Zheng

Research output: Contribution to journalArticle

30 Citations (Scopus)

Abstract

Peel-And-stick process, or water-Assisted transfer printing (WTP), represents an emerging process for transferring fully fabricated thin-film electronic devices with high yield and fidelity from a SiO2/Si wafer to various non-Si based substrates, including papers, plastics and polymers. This study illustrates that the fundamental working principle of the peel-And-stick process is based on the water-Assisted subcritical debonding, for which water reduces the critical adhesion energy of metal-SiO2 interface by 70 , 80%, leading to clean and high quality transfer of thin-film electronic devices. Water-Assisted subcritical debonding is applicable for a range of metal-SiO2 interfaces, enabling the peel-And-stick process as a general and tunable method for fabricating flexible/transparent thin-film electronic devices.

Original languageEnglish (US)
Article numberA2917
JournalScientific reports
Volume3
DOIs
StatePublished - Oct 10 2013

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fabrication
thin films
electronics
water
printing
metals
emerging
adhesion
plastics
wafers
polymers
energy

All Science Journal Classification (ASJC) codes

  • General

Cite this

Lee, C. H., Kim, J. H., Zou, C., Cho, I. S., Weisse, J. M., Nemeth, W., ... Zheng, X. (2013). Peel-And-stick: Mechanism study for efficient fabrication of flexible/ transparent thin-film electronics. Scientific reports, 3, [A2917]. https://doi.org/10.1038/srep02917
Lee, Chi Hwan ; Kim, Jae Han ; Zou, Chenyu ; Cho, In Sun ; Weisse, Jeffery M. ; Nemeth, William ; Wang, Qi ; Van Duin, Adri ; Kim, Taek Soo ; Zheng, Xiaolin. / Peel-And-stick : Mechanism study for efficient fabrication of flexible/ transparent thin-film electronics. In: Scientific reports. 2013 ; Vol. 3.
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Lee, CH, Kim, JH, Zou, C, Cho, IS, Weisse, JM, Nemeth, W, Wang, Q, Van Duin, A, Kim, TS & Zheng, X 2013, 'Peel-And-stick: Mechanism study for efficient fabrication of flexible/ transparent thin-film electronics', Scientific reports, vol. 3, A2917. https://doi.org/10.1038/srep02917

Peel-And-stick : Mechanism study for efficient fabrication of flexible/ transparent thin-film electronics. / Lee, Chi Hwan; Kim, Jae Han; Zou, Chenyu; Cho, In Sun; Weisse, Jeffery M.; Nemeth, William; Wang, Qi; Van Duin, Adri; Kim, Taek Soo; Zheng, Xiaolin.

In: Scientific reports, Vol. 3, A2917, 10.10.2013.

Research output: Contribution to journalArticle

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AU - Lee, Chi Hwan

AU - Kim, Jae Han

AU - Zou, Chenyu

AU - Cho, In Sun

AU - Weisse, Jeffery M.

AU - Nemeth, William

AU - Wang, Qi

AU - Van Duin, Adri

AU - Kim, Taek Soo

AU - Zheng, Xiaolin

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