Peel-And-stick: Mechanism study for efficient fabrication of flexible/ transparent thin-film electronics

Chi Hwan Lee, Jae Han Kim, Chenyu Zou, In Sun Cho, Jeffery M. Weisse, William Nemeth, Qi Wang, Adri C.T. Van Duin, Taek Soo Kim, Xiaolin Zheng

Research output: Contribution to journalArticle

37 Scopus citations

Abstract

Peel-And-stick process, or water-Assisted transfer printing (WTP), represents an emerging process for transferring fully fabricated thin-film electronic devices with high yield and fidelity from a SiO2/Si wafer to various non-Si based substrates, including papers, plastics and polymers. This study illustrates that the fundamental working principle of the peel-And-stick process is based on the water-Assisted subcritical debonding, for which water reduces the critical adhesion energy of metal-SiO2 interface by 70 , 80%, leading to clean and high quality transfer of thin-film electronic devices. Water-Assisted subcritical debonding is applicable for a range of metal-SiO2 interfaces, enabling the peel-And-stick process as a general and tunable method for fabricating flexible/transparent thin-film electronic devices.

Original languageEnglish (US)
Article numberA2917
JournalScientific reports
Volume3
DOIs
StatePublished - Oct 10 2013

All Science Journal Classification (ASJC) codes

  • General

Fingerprint Dive into the research topics of 'Peel-And-stick: Mechanism study for efficient fabrication of flexible/ transparent thin-film electronics'. Together they form a unique fingerprint.

  • Cite this

    Lee, C. H., Kim, J. H., Zou, C., Cho, I. S., Weisse, J. M., Nemeth, W., Wang, Q., Van Duin, A. C. T., Kim, T. S., & Zheng, X. (2013). Peel-And-stick: Mechanism study for efficient fabrication of flexible/ transparent thin-film electronics. Scientific reports, 3, [A2917]. https://doi.org/10.1038/srep02917