Performance analysis of heat sinks designed for additive manufacturing

Andrew Scott White, David Saltzman, Stephen Lynch

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Significant levels of heat are generated in contemporary electronics, and next generation devices will continue to demand higher power despite decreasing size; therefore, highly effective cooling schemes are needed. Simultaneously, advances in metal additive manufacturing have enabled production of complex heat transfer devices previously impossible to traditionally manufacture. This paper introduces three novel prototypes, originally designed for a prior ASME Student Heat Sink Design Competition sponsored by the K-16 (Heat Transfer in Electronic Devices) technical committee, to demonstrate the abilities of selective laser melting processes in the fabrication of A357 aluminum, EOS aluminum, and copper heat sinks. The performance of each of these prototypes has been determined experimentally, and the effects of specific material and design choices are analyzed. Comparisons of experimental results show that the copper and EOS aluminum prototypes performed better than the A357 aluminum due to increased thermal conductivity; however, the gains in thermal performance from EOS aluminum to copper were much lower despite the large difference in thermal conductivity.

Original languageEnglish (US)
Title of host publicationASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791884041
DOIs
StatePublished - 2020
EventASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020 - Virtual, Online
Duration: Oct 27 2020Oct 29 2020

Publication series

NameASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020

Conference

ConferenceASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020
CityVirtual, Online
Period10/27/2010/29/20

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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