Photocurable dielectrics for electronic packaging and encapsulant applications

Wuttichai Reainthippayasakul, Qing Wang, Michael Lanagan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish (US)
Title of host publication3D-PEIM 2016 - 2016 International Symposium on 3D Power Electronics Integration and Manufacturing
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509029402
DOIs
StatePublished - Sep 16 2016
Event1st International Symposium on 3D Power Electronics Integration and Manufacturing, 3D-PEIM 2016 - Raleigh, United States
Duration: Jun 13 2016Jun 15 2016

Publication series

Name3D-PEIM 2016 - 2016 International Symposium on 3D Power Electronics Integration and Manufacturing

Other

Other1st International Symposium on 3D Power Electronics Integration and Manufacturing, 3D-PEIM 2016
CountryUnited States
CityRaleigh
Period6/13/166/15/16

All Science Journal Classification (ASJC) codes

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

Cite this

Reainthippayasakul, W., Wang, Q., & Lanagan, M. (2016). Photocurable dielectrics for electronic packaging and encapsulant applications. In 3D-PEIM 2016 - 2016 International Symposium on 3D Power Electronics Integration and Manufacturing [7570556] (3D-PEIM 2016 - 2016 International Symposium on 3D Power Electronics Integration and Manufacturing). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/3DPEIM.2016.7570556