Abstract
Flexible 2.5 cm × 2.5 cm PZT thin films on polyimide substrate were successfully obtained through a release and transfer process developed in this work. The released films not only functioned, but had superior properties compared to films grown on silicon wafers. This approach to flexible piezoelectric devices provides opportunities for sensors, transducers, and energy harvesters.
| Original language | English (US) |
|---|---|
| Title of host publication | 75th Annual Device Research Conference, DRC 2017 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9781509063277 |
| DOIs | |
| State | Published - Aug 1 2017 |
| Event | 75th Annual Device Research Conference, DRC 2017 - South Bend, United States Duration: Jun 25 2017 → Jun 28 2017 |
Other
| Other | 75th Annual Device Research Conference, DRC 2017 |
|---|---|
| Country | United States |
| City | South Bend |
| Period | 6/25/17 → 6/28/17 |
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All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
Cite this
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Piezoelectric thin films on polyimide substrates for flexible piezoelectric devices. / Liu, Tianning; Wallace, Margeaux; Trolier-McKinstry, Susan E.; Jackson, Thomas Nelson.
75th Annual Device Research Conference, DRC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 7999459.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Piezoelectric thin films on polyimide substrates for flexible piezoelectric devices
AU - Liu, Tianning
AU - Wallace, Margeaux
AU - Trolier-McKinstry, Susan E.
AU - Jackson, Thomas Nelson
PY - 2017/8/1
Y1 - 2017/8/1
N2 - Flexible 2.5 cm × 2.5 cm PZT thin films on polyimide substrate were successfully obtained through a release and transfer process developed in this work. The released films not only functioned, but had superior properties compared to films grown on silicon wafers. This approach to flexible piezoelectric devices provides opportunities for sensors, transducers, and energy harvesters.
AB - Flexible 2.5 cm × 2.5 cm PZT thin films on polyimide substrate were successfully obtained through a release and transfer process developed in this work. The released films not only functioned, but had superior properties compared to films grown on silicon wafers. This approach to flexible piezoelectric devices provides opportunities for sensors, transducers, and energy harvesters.
UR - http://www.scopus.com/inward/record.url?scp=85028072297&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85028072297&partnerID=8YFLogxK
U2 - 10.1109/DRC.2017.7999459
DO - 10.1109/DRC.2017.7999459
M3 - Conference contribution
AN - SCOPUS:85028072297
BT - 75th Annual Device Research Conference, DRC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
ER -