Plane stress fracture toughness of freestanding nanoscale thin films

H. Hosokawa, A. V. Desai, Md Amanul Haque

Research output: Contribution to journalArticle

40 Citations (Scopus)

Abstract

Fracture toughness values of notched thin films were measured in-situ in the scanning electron microscope using a micro-machined experimental setup. Freestanding specimens, 200-300 nm thick, 2 μm wide and about 10 μm long, were fabricated from extruded gold micro-wire and sputtered aluminum films. The obtained values, 0.45 MPa m1/2 for gold and 0.51 MPa m1/2 for aluminum are on the same order of those for brittle materials. Such reduction in fracture toughness is discussed in light of reduced dislocation activities in the severely work hardened gold and dislocation starved aluminum specimens.

Original languageEnglish (US)
Pages (from-to)6444-6447
Number of pages4
JournalThin Solid Films
Volume516
Issue number18
DOIs
StatePublished - Jul 31 2008

Fingerprint

plane stress
fracture strength
Aluminum
Gold
Fracture toughness
gold
aluminum
Thin films
thin films
brittle materials
Brittleness
Electron microscopes
electron microscopes
wire
Wire
Scanning
scanning

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this

Hosokawa, H. ; Desai, A. V. ; Haque, Md Amanul. / Plane stress fracture toughness of freestanding nanoscale thin films. In: Thin Solid Films. 2008 ; Vol. 516, No. 18. pp. 6444-6447.
@article{905f336e18e54ee1baa3f64399060d94,
title = "Plane stress fracture toughness of freestanding nanoscale thin films",
abstract = "Fracture toughness values of notched thin films were measured in-situ in the scanning electron microscope using a micro-machined experimental setup. Freestanding specimens, 200-300 nm thick, 2 μm wide and about 10 μm long, were fabricated from extruded gold micro-wire and sputtered aluminum films. The obtained values, 0.45 MPa m1/2 for gold and 0.51 MPa m1/2 for aluminum are on the same order of those for brittle materials. Such reduction in fracture toughness is discussed in light of reduced dislocation activities in the severely work hardened gold and dislocation starved aluminum specimens.",
author = "H. Hosokawa and Desai, {A. V.} and Haque, {Md Amanul}",
year = "2008",
month = "7",
day = "31",
doi = "10.1016/j.tsf.2008.03.005",
language = "English (US)",
volume = "516",
pages = "6444--6447",
journal = "Thin Solid Films",
issn = "0040-6090",
publisher = "Elsevier",
number = "18",

}

Plane stress fracture toughness of freestanding nanoscale thin films. / Hosokawa, H.; Desai, A. V.; Haque, Md Amanul.

In: Thin Solid Films, Vol. 516, No. 18, 31.07.2008, p. 6444-6447.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Plane stress fracture toughness of freestanding nanoscale thin films

AU - Hosokawa, H.

AU - Desai, A. V.

AU - Haque, Md Amanul

PY - 2008/7/31

Y1 - 2008/7/31

N2 - Fracture toughness values of notched thin films were measured in-situ in the scanning electron microscope using a micro-machined experimental setup. Freestanding specimens, 200-300 nm thick, 2 μm wide and about 10 μm long, were fabricated from extruded gold micro-wire and sputtered aluminum films. The obtained values, 0.45 MPa m1/2 for gold and 0.51 MPa m1/2 for aluminum are on the same order of those for brittle materials. Such reduction in fracture toughness is discussed in light of reduced dislocation activities in the severely work hardened gold and dislocation starved aluminum specimens.

AB - Fracture toughness values of notched thin films were measured in-situ in the scanning electron microscope using a micro-machined experimental setup. Freestanding specimens, 200-300 nm thick, 2 μm wide and about 10 μm long, were fabricated from extruded gold micro-wire and sputtered aluminum films. The obtained values, 0.45 MPa m1/2 for gold and 0.51 MPa m1/2 for aluminum are on the same order of those for brittle materials. Such reduction in fracture toughness is discussed in light of reduced dislocation activities in the severely work hardened gold and dislocation starved aluminum specimens.

UR - http://www.scopus.com/inward/record.url?scp=44649090554&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=44649090554&partnerID=8YFLogxK

U2 - 10.1016/j.tsf.2008.03.005

DO - 10.1016/j.tsf.2008.03.005

M3 - Article

AN - SCOPUS:44649090554

VL - 516

SP - 6444

EP - 6447

JO - Thin Solid Films

JF - Thin Solid Films

SN - 0040-6090

IS - 18

ER -