Plasma-deposited silylation resist for 193 nm lithography

Mark William Horn, Mordechai Rothschild, Brian E. Maxwell, Russell B. Goodman, Roderick R. Kunz, Lynn M. Eriksen

Research output: Contribution to journalArticle

Abstract

Plasma-deposited carbon-based polymer films are examined for use as an all-dry positive-tone photoresist for 193 nm lithography. These films are designed to crosslink upon exposure to 193 nm radiation, enabling selective silicon uptake via reaction of silylamine gas with hydroxyl in the film. After oxygen plasma pattern transfer, features with resolution below 0.50 μm have been obtained with a 0.35 numerical aperture projection system.

Original languageEnglish (US)
Number of pages1
JournalApplied Physics Letters
StatePublished - Dec 1 1995

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lithography
oxygen plasma
numerical aperture
photoresists
projection
carbon
polymers
silicon
radiation
gases

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

Cite this

Horn, M. W., Rothschild, M., Maxwell, B. E., Goodman, R. B., Kunz, R. R., & Eriksen, L. M. (1995). Plasma-deposited silylation resist for 193 nm lithography. Applied Physics Letters.
Horn, Mark William ; Rothschild, Mordechai ; Maxwell, Brian E. ; Goodman, Russell B. ; Kunz, Roderick R. ; Eriksen, Lynn M. / Plasma-deposited silylation resist for 193 nm lithography. In: Applied Physics Letters. 1995.
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Horn, MW, Rothschild, M, Maxwell, BE, Goodman, RB, Kunz, RR & Eriksen, LM 1995, 'Plasma-deposited silylation resist for 193 nm lithography', Applied Physics Letters.

Plasma-deposited silylation resist for 193 nm lithography. / Horn, Mark William; Rothschild, Mordechai; Maxwell, Brian E.; Goodman, Russell B.; Kunz, Roderick R.; Eriksen, Lynn M.

In: Applied Physics Letters, 01.12.1995.

Research output: Contribution to journalArticle

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AU - Rothschild, Mordechai

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AU - Eriksen, Lynn M.

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Horn MW, Rothschild M, Maxwell BE, Goodman RB, Kunz RR, Eriksen LM. Plasma-deposited silylation resist for 193 nm lithography. Applied Physics Letters. 1995 Dec 1.