Plasma enhanced chemically vapor deposited thin films for microelectromechanical systems applications with tailored optical, thermal, and mechanical properties

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Abstract

Microbridge materials optimized for room temperature infrared microbolometers have been fabricated using plasma enhanced chemical vapor deposition (PECVD). Thin films were deposited from tetramethyldisiloxane (TMDS) and oxygen. They have a 4× lower thermal conductivity than that of Si3N4 and an inherent absorption coefficient (8-12 μm range) approximately half that of nitride. The PECVD films deposited from TMDS are compatible with current complementary metal-oxide-semiconductor processing and have been shown to have adequate mechanical strength for use as microbolometer membranes.

Original languageEnglish (US)
Pages (from-to)1045-1049
Number of pages5
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume17
Issue number3
StatePublished - Dec 1 1999

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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