Microbridge materials optimized for room temperature infrared microbolometers have been fabricated using plasma enhanced chemical vapor deposition (PECVD). Thin films were deposited from tetramethyldisiloxane (TMDS) and oxygen. They have a 4× lower thermal conductivity than that of Si3N4 and an inherent absorption coefficient (8-12 μm range) approximately half that of nitride. The PECVD films deposited from TMDS are compatible with current complementary metal-oxide-semiconductor processing and have been shown to have adequate mechanical strength for use as microbolometer membranes.
|Original language||English (US)|
|Number of pages||5|
|Journal||Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures|
|State||Published - Jan 1 1999|
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Electrical and Electronic Engineering