Polymer/inorganic nanocomposites opportunities for food packaging barrier

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Polymer/organoclay nanocomposites offer: concurrent property improvements (barrier + +) control of nanostructures at ton quantities (using industry's current processing methods) fine tuning of properties (e.g. prescribed value of fracture toughness, viz. peel strength) new functionalities (e.g. antimicrobial, FR) Viable Technology: Multiple commercial products However: They are not the solution to all materials properties problems or performance requirements !!

Original languageEnglish (US)
Title of host publicationPLACE Flexible Packaging Summit 2009 - 2009 Consumer Packaging Solutions for Barrier Performance Course and 2009 Symposium on Nanomaterials for Flexible Packaging
Pages724-752
Number of pages29
StatePublished - Dec 1 2009
Event2009 Consumer Packaging Solutions for Barrier Performance Course and 2009 Symposium on Nanomaterials for Flexible Packaging, PLACE Flexible Packaging Summit 2009 - Columbus, OH, United States
Duration: Apr 28 2009Apr 30 2009

Publication series

NamePLACE Flexible Packaging Summit 2009 - 2009 Consumer Packaging Solutions for Barrier Performance Course and 2009 Symposium on Nanomaterials for Flexible Packaging
Volume2

Other

Other2009 Consumer Packaging Solutions for Barrier Performance Course and 2009 Symposium on Nanomaterials for Flexible Packaging, PLACE Flexible Packaging Summit 2009
CountryUnited States
CityColumbus, OH
Period4/28/094/30/09

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All Science Journal Classification (ASJC) codes

  • Surfaces, Coatings and Films

Cite this

Manias, E. (2009). Polymer/inorganic nanocomposites opportunities for food packaging barrier. In PLACE Flexible Packaging Summit 2009 - 2009 Consumer Packaging Solutions for Barrier Performance Course and 2009 Symposium on Nanomaterials for Flexible Packaging (pp. 724-752). (PLACE Flexible Packaging Summit 2009 - 2009 Consumer Packaging Solutions for Barrier Performance Course and 2009 Symposium on Nanomaterials for Flexible Packaging; Vol. 2).