Predictive modeling of permeation for flexible packaging applications using finite element analysis

William J. Calvo, Brian A. Young, Paul E. Koch

Research output: Contribution to conferencePaper

Original languageEnglish (US)
Pages531-555
Number of pages25
StatePublished - Dec 1 2004
EventFlexible Packaging Conference 2004 - Atlanta, GA, United States
Duration: Mar 24 2004Mar 26 2004

Other

OtherFlexible Packaging Conference 2004
CountryUnited States
CityAtlanta, GA
Period3/24/043/26/04

Fingerprint

Permeation
Packaging
Finite element method

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Calvo, W. J., Young, B. A., & Koch, P. E. (2004). Predictive modeling of permeation for flexible packaging applications using finite element analysis. 531-555. Paper presented at Flexible Packaging Conference 2004, Atlanta, GA, United States.
Calvo, William J. ; Young, Brian A. ; Koch, Paul E. / Predictive modeling of permeation for flexible packaging applications using finite element analysis. Paper presented at Flexible Packaging Conference 2004, Atlanta, GA, United States.25 p.
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Calvo, WJ, Young, BA & Koch, PE 2004, 'Predictive modeling of permeation for flexible packaging applications using finite element analysis', Paper presented at Flexible Packaging Conference 2004, Atlanta, GA, United States, 3/24/04 - 3/26/04 pp. 531-555.

Predictive modeling of permeation for flexible packaging applications using finite element analysis. / Calvo, William J.; Young, Brian A.; Koch, Paul E.

2004. 531-555 Paper presented at Flexible Packaging Conference 2004, Atlanta, GA, United States.

Research output: Contribution to conferencePaper

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AU - Young, Brian A.

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Calvo WJ, Young BA, Koch PE. Predictive modeling of permeation for flexible packaging applications using finite element analysis. 2004. Paper presented at Flexible Packaging Conference 2004, Atlanta, GA, United States.