Present and future challenges in multilayer ceramic devices

Clive A. Randall, G. Yang, E. Dickey, R. E. Eitel, Thomas R. Shrout, Michael T. Lanagan, D. Kwon, E. Semouchkina, G. Semouchkin, S. Rhee, A. Baker

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

This paper builds on the work that has gone before and draws attention and emphasis to interfacial issues, new materials, and new device concepts. In regard to material interfaces, we demonstrate the importance of understanding local thermochemical processes as well as electrode-ceramic interdiffusion within multilayer capacitors and piezoelectrics. We also consider going beyond the traditional embedded capacitor components in high frequency LTCC and point out new opportunities with metamaterials. We introduce new dielectric materials that have intermediate permittivities and low loss characteristics, can be coined with A1 electrodes, and may lay the foundations for an ultra low temperature cofired ceramics (550°C). Finally, we also embrace the concept of alternative applications for LTCC and demonstrate the use of dielectrophoretic forces to control colloidal particle flow in microchannels.

Original languageEnglish (US)
Title of host publicationProceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005
Pages1-8
Number of pages8
StatePublished - Dec 1 2005
Event1st International Conference and Exhibition on Ceramic Microsystems Technologies, CICMT 2005 - Co-located with the 107th Annual Meeting of the American Ceramic Society, ACerS 2005 - Baltimore, MD, United States
Duration: Apr 10 2005Apr 13 2005

Publication series

NameProceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005

Other

Other1st International Conference and Exhibition on Ceramic Microsystems Technologies, CICMT 2005 - Co-located with the 107th Annual Meeting of the American Ceramic Society, ACerS 2005
CountryUnited States
CityBaltimore, MD
Period4/10/054/13/05

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All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Materials Chemistry

Cite this

Randall, C. A., Yang, G., Dickey, E., Eitel, R. E., Shrout, T. R., Lanagan, M. T., Kwon, D., Semouchkina, E., Semouchkin, G., Rhee, S., & Baker, A. (2005). Present and future challenges in multilayer ceramic devices. In Proceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005 (pp. 1-8). (Proceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005).