Printed circuit board assembly/soldering initiatives at Penn State

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

Surface mount technology (SMT) is having a significant impact in the printed circuit board industry given implications of this technology on component size/weight considerations, board density, assembly and testing. Large segments of the industry are converting from through hole technology to surface mount and engineers find they have to master new processes and keep informed of new developments. With initial support from the AT&T Manufacturing Foundation and current support from the National Science Foundation, the Industrial Engineering Department at Penn State has developed a laboratory to support most processes required for assembly of printed circuit boards with mixed technology. This paper provides a brief description of two recent educational initiatives involving this technology as well as other aspects of electronic manufacturing.

Original languageEnglish (US)
Title of host publication13th IEEE/CHMT International Electronics Manufacturing Technology Symposium - Integrated Manufacturing
Subtitle of host publicationThe Future Is Now, IEMT 1992
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages169-173
Number of pages5
ISBN (Electronic)0780307550, 9780780307551
DOIs
StatePublished - Jan 1 1992
Event13th IEEE/CHMT International Electronics Manufacturing Technology Symposium, IEMT 1992 - Baltimore, United States
Duration: Sep 28 1992Sep 30 1992

Publication series

Name13th IEEE/CHMT International Electronics Manufacturing Technology Symposium - Integrated Manufacturing: The Future Is Now, IEMT 1992

Conference

Conference13th IEEE/CHMT International Electronics Manufacturing Technology Symposium, IEMT 1992
CountryUnited States
CityBaltimore
Period9/28/929/30/92

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

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  • Cite this

    Lehtihet, E. A. (1992). Printed circuit board assembly/soldering initiatives at Penn State. In 13th IEEE/CHMT International Electronics Manufacturing Technology Symposium - Integrated Manufacturing: The Future Is Now, IEMT 1992 (pp. 169-173). [639884] (13th IEEE/CHMT International Electronics Manufacturing Technology Symposium - Integrated Manufacturing: The Future Is Now, IEMT 1992). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEMT.1992.639884