Abstract
Dry wafer cleaning is emerging as a viable process technology. Still, there are some problems that need to be overcome in order for dry wafer cleaning to meet stringent requirements of advanced integrated circuits (IC) manufacturing. In this paper, problems that still need to be resolved in order to fully implement this surface treatment mode are identified and possible solutions are considered.
| Original language | English (US) |
|---|---|
| Title of host publication | Proceedings, Annual Technical Meeting - Institute of Environmental Sciences |
| Editors | Anon |
| Publisher | Publ by Inst of Environmental Sciences |
| Pages | 274 |
| Number of pages | 1 |
| Volume | 1 |
| ISBN (Print) | 1877862193 |
| State | Published - 1993 |
| Event | Proceedings of the 39th Annual Technical Meeting of Institute of Environmental Sciences - Las Vegas, NV, USA Duration: May 2 1993 → May 7 1993 |
Other
| Other | Proceedings of the 39th Annual Technical Meeting of Institute of Environmental Sciences |
|---|---|
| City | Las Vegas, NV, USA |
| Period | 5/2/93 → 5/7/93 |
All Science Journal Classification (ASJC) codes
- Environmental Engineering