Problems and solutions in dry wafer cleaning technology

Jerzy Ruzyllo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Dry wafer cleaning is emerging as a viable process technology. Still, there are some problems that need to be overcome in order for dry wafer cleaning to meet stringent requirements of advanced integrated circuits (IC) manufacturing. In this paper, problems that still need to be resolved in order to fully implement this surface treatment mode are identified and possible solutions are considered.

Original languageEnglish (US)
Title of host publicationProceedings, Annual Technical Meeting - Institute of Environmental Sciences
Editors Anon
PublisherPubl by Inst of Environmental Sciences
Pages274
Number of pages1
Volume1
ISBN (Print)1877862193
StatePublished - 1993
EventProceedings of the 39th Annual Technical Meeting of Institute of Environmental Sciences - Las Vegas, NV, USA
Duration: May 2 1993May 7 1993

Other

OtherProceedings of the 39th Annual Technical Meeting of Institute of Environmental Sciences
CityLas Vegas, NV, USA
Period5/2/935/7/93

All Science Journal Classification (ASJC) codes

  • Environmental Engineering

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  • Cite this

    Ruzyllo, J. (1993). Problems and solutions in dry wafer cleaning technology. In Anon (Ed.), Proceedings, Annual Technical Meeting - Institute of Environmental Sciences (Vol. 1, pp. 274). Publ by Inst of Environmental Sciences.