Quantitative acoustic model for adhesion evaluation of PMMA/silicon film structures

H. S. Ju, Bernhard R. Tittmann

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A Poly-methyl-methacrylate (PMMA) film on a silicon substrate is a main structure for photolithography in semiconductor manufacturing processes. This paper presents a potential of scanning acoustic microscopy (SAM) for nondestructive evaluation of the PMMA/Si film structure, whose adhesion failure is commonly encountered during the fabrication and post-fabrication processes. A physical model employing a partial discontinuity in displacement is developed for rigorously quantitative evaluation of the interfacial weakness. The model is implanted to the matrix method for the surface acoustic wave (SAW) propagation in anisotropic media. Our results show that variations in the SAW velocity and reflectance are predicted to show their sensitivity to the adhesion condition. Experimental results by the v(z) technique and SAW velocity reconstruction verify the prediction.

Original languageEnglish (US)
Title of host publicationReview of Progress in Quantitative Nondestructive Evaluation
Pages1182-1189
Number of pages8
Volume1211
DOIs
StatePublished - Apr 1 2010
Event36th Annual Review of Progress in Quantitative Nondestructive Evaluation, QNDE - Kingston, RI, United States
Duration: Jul 26 2009Jul 31 2009

Other

Other36th Annual Review of Progress in Quantitative Nondestructive Evaluation, QNDE
CountryUnited States
CityKingston, RI
Period7/26/097/31/09

Fingerprint

silicon films
polymethyl methacrylate
adhesion
acoustics
evaluation
fabrication
anisotropic media
photolithography
matrix methods
wave propagation
discontinuity
manufacturing
microscopy
reflectance
scanning
sensitivity
silicon
predictions

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

Cite this

Ju, H. S., & Tittmann, B. R. (2010). Quantitative acoustic model for adhesion evaluation of PMMA/silicon film structures. In Review of Progress in Quantitative Nondestructive Evaluation (Vol. 1211, pp. 1182-1189) https://doi.org/10.1063/1.3362189
Ju, H. S. ; Tittmann, Bernhard R. / Quantitative acoustic model for adhesion evaluation of PMMA/silicon film structures. Review of Progress in Quantitative Nondestructive Evaluation. Vol. 1211 2010. pp. 1182-1189
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Ju, HS & Tittmann, BR 2010, Quantitative acoustic model for adhesion evaluation of PMMA/silicon film structures. in Review of Progress in Quantitative Nondestructive Evaluation. vol. 1211, pp. 1182-1189, 36th Annual Review of Progress in Quantitative Nondestructive Evaluation, QNDE, Kingston, RI, United States, 7/26/09. https://doi.org/10.1063/1.3362189

Quantitative acoustic model for adhesion evaluation of PMMA/silicon film structures. / Ju, H. S.; Tittmann, Bernhard R.

Review of Progress in Quantitative Nondestructive Evaluation. Vol. 1211 2010. p. 1182-1189.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Ju HS, Tittmann BR. Quantitative acoustic model for adhesion evaluation of PMMA/silicon film structures. In Review of Progress in Quantitative Nondestructive Evaluation. Vol. 1211. 2010. p. 1182-1189 https://doi.org/10.1063/1.3362189